Used SATISLOH Toro-X-2000 #9362273 for sale

SATISLOH Toro-X-2000 is a machine designed for precision wafer grinding, lapping and polishing. It is suitable for semiconductor applications including MEMS and ASIC production. The machine offers superior performance in a small footprint. The key features of Toro-X-2000 include: Grinding Systems: SATISLOH Toro-X-2000 is equipped with precision grinding systems specifically designed for the ultra-smooth finishes required for MEMS and ASIC production. The grinding equipment is able to achieve a fine surface finish of up to 0.3 microns depending on the material. It also can achieve very uniform surfaces with stable thickness of the wafers. The grinding system is equipped with special grinding disks that are connected to a precision servo motor and a high-accuracy drive, allowing for precise grinding processes. Lapping Unit: Toro-X-2000 is equipped with a precision lapping machine that is designed to produce flat and optically clear wafers with extremely high flatness. The lapping tool is equipped with multiple precision-machined platens for superior uniformity and reliable results. The asset also includes special polishing compounds that are suitable for different types of wafers, providing accurate and repeatable results. Polishing Model: SATISLOH Toro-X-2000 is equipped with a polishing equipment to produce highly polished wafers with a high accuracy finish. The polishing system is equipped with a special polishing mop connected to an extremely accurate drive and servo motor providing a high accuracy finish. The polishing mop is also equipped with advanced polishing compounds to ensure a consistent and repeatable finish. Safety Features: Toro-X-2000 is designed with various safety features to ensure that the machine is operated safely by the operator. It includes a machine lid safety switch, an E-stop button, and an emergency stop button. Additionally, the machine also provides end of cycle detection to alert the operator. Overall, SATISLOH Toro-X-2000 is an ideal machine for precision wafer grinding, lapping, and polishing processes. It offers superior grinding, lapping, and polishing systems equipped with special polishing compounds, precise servo motors, and high accuracy drives. Moreover, it features a variety of safety features to ensure operator protection. It is suitable for semiconductor applications including MEMS and ASIC production.