Used TAMUKAI TLP-6B #9224522 for sale

TAMUKAI TLP-6B wafer grinding, lapping and polishing equipment is a multi-purpose, semi-automated system designed to meet the needs of various semiconductor and related industries for high-precision wafer grinding, lapping, and polishing. The unit is available in either left-handed or right-handed configurations, depending on the application. TLP-6B features a high-performance, air-drive central spindle for higher precision grinding and lapping operations. The speed is adjustable up to 4,000 rpm, and the spindle features a direct-drive power transmission for reduced vibration and superior accuracy. A wide range of grinding and polishing wheels are available for TAMUKAI TLP-6B, allowing for precise customization for a variety of applications. TLP-6B also includes a single-axis precision stage for grinding and lapping wafers, plus a precision bearing for precise and repeatable positioning. The machine is designed for use with both dry and wet grinding/polishing processes, making it suitable for lapping and polishing wafers in both production and R&D environments. In addition, the tool includes a manual or optional automatic polishing asset, which uses a vacuum chuck with a central vacuum port to allow for repeatable polishing operations and can accommodate a variety of substrates. The model also has a dual-axis traverse stage to accommodate both large and small substrates, as well as an automatic process controller to ensure optimal polishing results. TAMUKAI TLP-6B features an ergonomic design with user-friendly controls, allowing operators to easily set the proper grinding speed and feed rates. This ensures that the operator can easily adjust the settings to match the specific parameters for their application. The equipment also features error-proof operation, as well as a warning light to ensure that all operations are running smoothly. Overall, TLP-6B wafer grinding, lapping, and polishing system is an excellent choice for applications requiring high-precision grinding and lapping operations. With its powerful central drive spindle, precision bearing, and wide range of grinding and polishing wheels, the unit can deliver the accuracy and repeatability required for complex projects. The intuitive controls, automatic process controller, ergonomic design, and user-friendly interface also make TAMUKAI TLP-6B an excellent choice for operations in both production and research environments.