Used TAMUKAI TLP-9B #9050601 for sale

TAMUKAI TLP-9B is a wafer grinding, lapping and polishing equipment aimed at providing industry-level lithography and production-level flat optics applications. The system can provide a high-precision machined surface utilizing a dry-mode grinding and polishing process in combination with a combined abrasive/ultrasonic grinding. This unit is equipped with both manual and automatic control for its grinding and polishing stages, allowing users to quickly and efficiently achieve high-precision machined surfaces. TLP-9B machine consists of several components that form a processing center to consistent and reliable grind, lap, and polish wafers. The Wet Grinding Unit is designed to quickly and efficiently clean and roughen the surface of a wafer in preparation for further processing. This is a high speed operation driven by a two-axis, direct-drive motor with adjustable speed and force control. The Lapping/Polishing Unit is designed to produce a smooth, finished surface. This process uses a custom-developed two-headed motion to ensure a smooth, repeatable surface finish. This process is driven by a servo-motor with adjustable speed, and adjustable down force parameters. The Cleaning Station is designed to clean off any residue left behind from either of the grinding or polishing stations. This station includes a high-powered waterjet nozzle, and utilizes unique agitation to clean the wafer surface quickly and effectively. TAMUKAI TLP-9B tool also provides a user-friendly graphical user interface to quickly and effectively control all grinding and polishing parameters necessary for the desired results. The user can set the asset to operate in an automated fashion, and can easily observe the progress of the operation using the visual feedback provided. Additionally, this model is equipped with a data logging equipment, which records all data pertaining to the application and can be used to generate reports to monitor the success of the process. Overall, TLP-9B system is a reliable unit for producing polished and finished wafers at an industrial-level production rate. It is designed to provide repeatable results while using state-of-the-art components and software. This machine is also easy to program and use, making it suitable for both large-scale and small-scale applications.