Used TAMUKAI TLP-9B #9224523 for sale

TAMUKAI TLP-9B is an automatic wafer grinding, lapping, and polishing equipment designed to provide high throughput and precision process control. This system consists of a vibrating table, liquid slurry dispenser, and two separate lapping and polishing heads. The vibrating table decks are adjustable to facilitate single or double-sided wafer lapping and polishing operations with full vibration control. An enclosed design allows for effective noise and dust control during the grinding and polishing process. The lapping and polishing heads feature independendently adjustable auto-track speed and linewidth compensation and pressure control to maintain a precise distance and pressure on the wafer surface. The slurry dispenser enables consistent and accurate wet slurry delivery to the lapping and polishing heads to prevent too much or too little slurry from prematurely damaging the wafer surface. TLP-9B has been designed with a powerful electrical direct drive that guarantees a fully automatic, operator-independent process cycle with high process quality and repeatability. The unit is also equipped with a computer-compatible process monitoring and control unit along with a user-friendly interface, which enables the operator to easily and quickly input process parameters from a central display and keyboard. Furthermore, TAMUKAI TLP-9B machine uses "adaptive speed" technology, which adjusts the speed of each lapping and polishing head to the current load in order to achieve optimal grinding and polishing results. This allows for faster completion times without compromising the end result. TLP-9B is the perfect solution for wafer grinding, lapping, and polishing due to its power, control, and precision. This tool is ideal for those looking to achieve high throughput and excellent process quality with low maintenance and minimized waste of material.