Used TAMUKAI TLP-P-810 #9012562 for sale

TAMUKAI TLP-P-810 wafer grinding, lapping & polishing equipment is an ideal precision solution for effective polishing of all kinds of semiconductor wafers. It is specifically designed for high productivity applications with extremely tight tolerance requirements. The precision of this system features PLC digital control and adjustable parameters. This allows the processing of different kinds of wafers at different speeds, as well as fine-tuning for specific applications. Additionally, TLP-P-810 is equipped with a fully worked vibration isolation unit, enhancing its accuracy and reliability. The grinding machine of TAMUKAI TLP-P-810 consists of two 300 mm fine grinding flat lapping plates that are actuated by a single, high-power motor. This ensures the precision of the grinding process, which is essential in the semiconductor industry. The lapping piece-holder is equipped with a quick release mechanism, enabling an easy and quick change of the lapping plate in case of damage or grinding surface change. The lapping plates feature a built-in ceramic material and special compound, which ensures an even surface finish. The polishing process is then done by an advanced point-polishing tool, which incorporates a specially designed secure collet and ceramic coated polishing pads. This design reduces the variation of the polishing quality, providing a precise final result. TLP-P-810 asset was designed to ensure maximum user safety. Its operation requires the activation of an interlock switch. Moreover, the optional remote operations feature enables the operator to control the model from a remote location, ensuring the operator's safety. TAMUKAI TLP-P-810 has a wide range of applications, including the lapping of silicon wafers, ceramic components and printed circuit boards. This efficient and precise machine is a great addition to any semiconductor fabrication laboratory or production line.