Used TOSHIBA KRTC-11A #9259502 for sale

TOSHIBA KRTC-11A is a high-efficiency wafer grinding, lapping, and polishing equipment designed to produce superior processing results with minimum machine downtime. This system features precision grinding and lapping capabilities that enable precision wafers to be processed in the same unit that is used for production runs, providing unmatched repeatability and quality. KRTC-11A includes a unique, vertical design that is ideal for limited-floor-space facilities. This vertical design enables operators to make efficient use of the machine while keeping overhead and floor space to a minimum. The tool is engineered with a large, removable stainless steel slurry bowl to maximize production output within the same footprint. The asset uses a two-channel drive model to control the grinders, lapping plate, and polishers, as well as a three-phase motor for high-accuracy production with minimal lapping waste. The equipment also supports multiple abrasive media types, ranging from diamond to conventional alumina, graphite, and silicon carbide. Additionally, the system includes either two-, four-, or eight-inlet liquids tanks to provide ample and adjustable grinding media supply for a tailored process. TOSHIBA KRTC-11A is also equipped with fully-integrated and automated controls, including an intuitive graphical user interface that guides operations. This user-friendly unit provides users with a simple command-and-control machine with real-time verification. The tool also features comprehensive diagnostics and maintenance updates, such as automatic tool-life tracking and full monitoring of asset processes and process parameters. Finally, for accurate results, KRTC-11A includes a single-axis drive that maintains tight process tolerances with minimal lapping waste. This model also contributes to maximum production yields and a superior finish quality. Overall, TOSHIBA KRTC-11A is a sophisticated, cost-effective, and compact solution for small- to medium-sized production facilities that require superior wafer grinding, lapping, and polishing processes.