Used TOSHIBA UHG-130C #9259499 for sale

TOSHIBA UHG-130C is a precision wafer grinding, lapping and polishing equipment, designed for high volume production of quality semiconductor wafers. This second-generation system features a 6-axis robotic arm for precise, controlled wet and dry grinding, lapping and polishing of semiconductor wafers of up to 12-inch diameter. The unit is capable of processing substrates with higher than normal flatness requirements and feature sizes as small as 20nm. UHG-130C machine is equipped with a high-precision spindle that delivers greater speed, accuracy, and processing control. Additionally, its modern design includes three-axis travel with tilt and height adjustments and boasts a one-third increase in travel speed over its predecessor, providing an improved grinding and polishing process. In order to ensure a consistent quality across a substrate's entire surface, TOSHIBA UHG-130C utilizes advanced automatic control algorithms, creating conditions that are uniform across the entire wafer. This ensures a quality substrate finish with exact consistency between each wafer processed on the tool. UHG-130C can also be configured with platen fixtures to adjust to multiple wafer formats, enabling a wide range of wafer formats to be processed without the need for changes in the machine setup. Furthermore, the asset is designed to process a variety of work piece materials including silicon, sapphire, and ceramic substrates. TOSHIBA UHG-130C also features a range of automation options for improved production throughput and repeatable results. These features include a wafer loading/unloading model, integrated safety sensors, and barcode reading capabilities. The equipment is also equipped with real-time condition monitoring, allowing for automated maintenance and diagnostics. This system is also designed with an integrated chemistry-free environment for improved cleanliness and prevents contamination of the substrate surface. Finally, UHG-130C can be used in a variety of environmentally controlled and cleanroom applications, with easy configuration and compatibility with existing infrastructure. Its stainless steel construction is designed for easy integration into existing facilities and provides superior hygienic safety. TOSHIBA UHG-130C is the ideal solution for high accuracy, high speed processes, current integrated process steps, and automated production of electronic semiconductor components.