Used ADE / KLA / TENCOR 7000 #9239664 for sale

ADE / KLA / TENCOR 7000 is a state-of-the-art wafer testing and metrology equipment developed by ADE Technologies. This versatile platform is designed to test, measure and inspect wafers up to seven inches in diameter. It is suitable for any wafer type, with the ability to accommodate crystalline and semiconductor materials, SOI, MEMS and other micro-device substrates. The system is based on a patented die-to-die alignment technology that combines fully automated smart scanning stages with high-resolution beam imaging to provide accurate wafer mapping and defect monitoring. The universal-sized wafer handling unit supports a wide range of wafer types, providing complete wafer coverage for reliable testing and metrology. With its comprehensive metrology capabilities, it delivers highly accurate measurements of both fine and macro features. Its surface and non-contact techniques are capable of detecting small defects on highly polished surfaces, with feature measurements down to the nanometer range. Other features include pattern recognition and 3D shape measurement of surface variation, as well as thorough contaminant testing. The machine is equipped with high-speed hybrid image processing capability, with direct access to complex process control data. The built-in computation module enables advanced defect analysis, including profiling of size, count, location and other parameters. The software also allows quick, easy capture and distribution of images, video, data and reports to any screen or monitor. For process integration, the tool is designed with advanced automation protocols, allowing easy integration with certain manufacturing networks. Its sophisticated software-equipped asset also helps automate device parameter measurement, with fault detection and reporting, and real-time data logging. ADE 7000 is a reliable wafer testing and metrology model, providing efficient and reliable results for industries such as semiconductor, reliability, metrology and others. Its fully automated smart scanning stages and high accuracy beam imaging combined with advanced metrology capabilities make it an ideal choice for testing and measuring wafers up to seven inches in diameter.