Used ADE / KLA / TENCOR UltraScan 9600 #9222305 for sale
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ID: 9222305
Wafer Size: 8"
Wafer inspection system, 8"
Ultra controller: Series 350 ARM controller
1/2” Floppy – 5 1/4” floppy
High resolution probe
Non-contact capacitive probe measurement
Resolution: 10 um
Microns wafer thickness range: 400 to 800
Capable of measuring:
Lapped
Etched
Polished and patterned wafers
Measures bow and warp
Site and global flatness
Thickness with res station
System consist of:
(2) Cassette input stations
(3) Cassette output stations
Pre-aligner station
Hi-RES station
E-PLUS Advanced / Thickness, B/W station
Signal effector arm robot
9600 Power supply
Non contact P/N type tester for wafer resistivity from 0.1 to 200 ohm-cm
ADE 350 Arm controller
Auto A probe
ASC Controller.
ADE / KLA / TENCOR UltraScan 9600 is an advanced wafer testing and metrology equipment designed for high performance and accuracy. The system provides sub-micron defect detection capabilities and a large wafer capacity. With a large 27-inch touchscreen monitor, the unit offers a convenient and easy-to-use interface for a range of wafer test, inspection, and metrology applications. ADE UltraScan 9600 features industry-leading defect analysis technology, enabling users to detect and characterize defects with sub-micron accuracy. The machine's AutoDeck AutoTuneTM auto-calibration technology ensures accurate test results across multiple wafers. The tool is also able to process an array of wafers at once, providing high throughput for higher yields and shorter turnaround times. KLA ULTRA SCAN 9600 is also equipped with an advanced stage control asset that provides superior stage stability and vibration isolation, thereby reducing noise from the model and eliminating cross-talk between module and wafer. Additionally, the equipment offers high vibration immunity and RF rejection, resulting in higher throughput and repeatable test results. The system is designed for easy integration, enabling users to connect to PCs and other external systems with a USB port. The oscillation function ensures high accuracy by adjusting the wafer positioning in the cradle. Additionally, the unit includes smart alarms for early warnings of drift or damage, allowing for fast and accurate troubleshooting. TENCOR ULTRA SCAN 9600 also has a library of advanced algorithms to support a range of metrology applications. These algorithms include characterization of wafer surface roughness, thickness, linearity, and non-uniformity. These algorithms can detect small dimensional changes and perform automated data analysis, enabling users to make faster and more accurate decisions. UltraScan 9600 also offers an extensive range of data analysis tools, including automated variability trending, sorting, and statistical analysis. These tools help identify defective parts in a machine, ensuring maximum performance and reliability. Overall, TENCOR UltraScan 9600 is a powerful and reliable wafer testing and metrology tool. It offers advanced technology for superior defect detection and asset performance, and its integration capabilities make it an ideal choice for a variety of metrology applications.
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