Used FEI DA300 #9259261 for sale
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ID: 9259261
Wafer Size: 12"
Vintage: 2005
Defect analyzer, 12"
ADR / ADX and Defect explorer function
Sirion SEM column
Side winder ion column
20664 Metal dep GIS
24919 Idep II
20377 Insulator enhanced etch
27820 Chiller (SM)
27040 Optical microscope color with separate monitor
402219861750 LPO fixload (6) Express
Wafer, 12"
(2) FOUP
Dry cool detector
TS800 Defect review
28080 FEI EDX Installed kit / EDX Interface
22448 EDWARDS iQDP40 Dry pump
UPS 15 kVA
17767 TEAM TP-6530 Video printer
402226169640 NANO Lift system package
With (TSU and In-Situ Probing and Loading station)
28557 / 28559 OXFORD INCA 200 for FEI
(12) 402226800872 Transfer cartridges
(50) 402226200773 Omniprobe needles
402226245431 TEM Grids
2005 vintage.
FEI DA300 is a wafer testing and metrology equipment developed by FEI company to help improve the accuracy and efficiency of wafer testing. The system is designed to provide high-precision, repeatable results, while maintaining a fast cycle time. The unit features a high-resolution optical platform, a scanning electron microscope (SEM), a focused ion beam (FIB), and a mass spectrometer to provide a range of measurement capabilities. The optical platform uses a 5MP camera to enable high-precision imaging up to 2 micron resolution. It also allows for a variety of imaging techniques to be used, such as dark field imaging, bright field imaging, and polarized imaging. The SEM is able to capture images at resolutions down to the nanometer level, and can be used to analyze electrical and chemical properties of the device being tested. The FIB provides a more targeted approach to device characterization by allowing localized milling and deposition of samples. Finally, the mass spectrometer provides a non-destructive method of analyzing chemical or molecular composition of a sample. DA300 is also equipped with a variety of automated features to increase efficiency. It includes a robotic sample handler to allow for rapid loading and unloading of wafers from the machine. It also includes a vacuum tool and sample stage to enable accurate, repeatable positioning of the sample at each measurement station. The asset works in combination with a suite of software specifically designed to take advantage of the advanced hardware capabilities. FEI DSA software is used to program the robotic sample handler to scan and measure multiple wafers in a single cycle. The EMate software is used to analyze SEM images, while the Genix software is used to control the FIB. Finally, FEI Extend software is used to link the various elements of the model together and provide an integrated interface for all measurements. Overall, FEI DA300 is a powerful tool for wafer testing and metrology. Its advanced hardware and automated capabilities enable a high degree of accuracy and throughput, while its comprehensive suite of software ensures seamless integration between all elements of the equipment.
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