Used KLA / TENCOR / PROMETRIX RS-100 #9123627 for sale

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ID: 9123627
Wafer Size: 8"-12"
Vintage: 2006
Resistance mapping system, 8"-12" Single open cassette handler Robot: ATM-107-2-S-CE-S293 Single fork Controller: 6-0002-0865-SP Trackball and keyboard standard Alignment system: Camera Factory automation: E40, E94, E90, E87 PC Configuration CPU: PIII 850 MHz Memory: 512 MB RAM 70 GB Fixed hard disk drive 17" VGA Monitor CD-ROM Drive Diskette drive capacity: 1.44 MB Software configuration: OS: Windows NT 4.00.1381 RS-100 Version: 2.31.04 Resistivity tester firmware: 1.02a Measurement specification: Measurement range: 5m Ohm/sq - 5m Ohm/sq Absolute accuracy: 1% of NSIT certified range Temperature accuracy: 0.5°C Temperature repeat-ability: 0.2°C Routine check: 1-30 sites programmable Single or dual configuration capability 220 V, 15 A, 50/60 Hz, 1 Phase 2006 vintage.
KLA / TENCOR / PROMETRIX RS-100 Wafer Testing and Metrology Equipment is a multi-purpose solution for thin wafer inspection and characterization. Using patented green laser technology and advanced image processing algorithms, it promises greater accuracy, speed and repeatability for non-contact inspection of delicate sample surfaces. It is capable of measuring with excellent accuracy from 10 nm to 10 mm, making it suitable for a range of applications from semiconductor metrology and lithography to flat panel display and solar cell metrology and inspection. The key features of the system include: 1. The use of low energy green laser unit, offering superior resolution and power stability. As a result, no additional focusing machine or sample preparation is required. 2. Automated image processing algorithms, as well as providing complete programmability and robustness of operation. 3. A wide measurement range of 10 nm to 10 mm. 4. High accuracy and repeatability. 5. Bonding and studding sign off capability. 6. High overlay accuracy, operating on a sub 50 nm range. 7. Processing at the wafer level, in order to obtain all the required measurements on a single chip. 8. Defect classification, topography and cross-sectional imaging. 9. The ability to detect and isolate different types of defects. In addition, it includes advanced substrate handling technologies, as well as a variety of core systems and options that can be combined and tailored to specific requirements. Among these are wafer positioning sensors and actuators, as well as advanced pattern recognition software. All of these features ensure that KLA RS-100 offers superior performance, accuracy and adaptability to complex wafer metrology and inspection applications.
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