Used KLA / TENCOR / PROMETRIX RS-55TCA #9275709 for sale

KLA / TENCOR / PROMETRIX RS-55TCA is a wafer testing and metrology equipment that provides a comprehensive set of tools for measuring parameters such as average and local thickness, surface topography, surface roughness, defect density, and other characteristics. Built for precision and repeatability, KLA RS 55 TCA offers superior performance without compromising accuracy. TENCOR RS-55/TCA uses a sophisticated combination of optical metrology techniques to measure wafer surfaces. These techniques include scatterometry, ellipsometry, photoluminescence, polarimetry, and secondary electron microscopy. The system also utilizes advanced motion control systems and proprietary algorithms to precisely deliver the highest accuracy results in the smallest amount of time. KLA / TENCOR / PROMETRIX RS 55 TCA application software provides a comprehensive suite of analysis tools designed to automatically detect defects on the surface of the wafer. These tools are used to detect and characterize the subtle effects caused by process changes, as well as to categorize defects in order to identify potentially troublesome elements and concentrations. The unit also provides a detailed die-to-die report, which enables users to quickly isolate errors and reduce waste. The advanced motion control machine used in KLA / TENCOR / PROMETRIX RS-55/TCA is designed for accuracy and repeatability in wafer scanning. This tool enables sub-micron scanning of wafers at speeds up to 150mm/s. The software provides the ability to detect and measure imperfections that may affect the quality and performance of the device wafers, as well as the ability to easily detect changes in process conditions. KLA RS-55TCA is designed to meet the most demanding wafer surface metrology requirements, and is optimized for robust, reliable, and repeatable wafer testing. It offers unparalleled accuracy in measuring thickness, surface topography, and surface roughness. The asset can also detect a wide variety of wafer defects and enable automated post-processing to guarantee accuracy and precision in the analysis. Additionally, the model has the ability to measure up to thirty thousand die per wafer, and can scan up to twenty-five wafers per hour, ensuring quick turnaround times and improved productivity. RS-55 TCA is the ideal solution for semiconductor quality control and wafer process optimization.