Used KLA / TENCOR / PROMETRIX UV 1050 #9182564 for sale
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Wafer Size: 4"-8"
Film thickness measurement system, 4"-8" Handling robot: H2 Stage resolution: XY-0.25μm, Z-0.025μm Source: Broadband xenon lamp (250nm to 750nm) Imaging system: Color camera with pattern rec (COGNEX System) PC: Intel P3 450MHz OS: Summit 2.4 based on Windows NT4.0 SECS II Interface 1997 vintage.
KLA / TENCOR / PROMETRIX UV 1050 is a wafer testing and metrology equipment. It is designed to provide reliable and repeatable measurements of both thin and ultra-thin wafers. It is capable of measuring various parameters, such as resistivity, thickness, topography, and composition. This system uses scanning electron microscope (SEM) technology and a range of detectors to accurately measure the metrology and electrical properties of thin and ultra-thin samples. A variety of sub-sampling tools are available to measure a range of parameters, including resistivity, topography, and power. The unit is equipped with a variable high-speed XY scan to reduce test time, and a variable angular platform with a variable step size. The angular platform is capable of selecting different angles and thus creating more detailed topography maps. The machine also has two cameras with variable magnification, allowing users to zoom in on details of different areas. KLA UV 1050 also comes equipped with a microscope, designed to provide users with highly detailed images of a sample. Furthermore, the tool also offers spectroscopy capabilities, allowing for a range of measurements to be taken. This asset is capable of measuring thin and ultra-thin wafers with a thickness of up to 500 nm. The model also offers a built-in thermocouple that can be used to measure temperature. The output from the thermocouple is converted into an amplitude or frequency signal, which is in turn used to make the measurements. With its range of measurement capabilities, TENCOR UV-1050 is an excellent tool for researchers and laboratories who desire repeatable and reliable measurements. Additionally, the equipment provides a high level of flexibility, allowing users to select the best tool for the job. As such, it is an essential tool for those who need precision measurements of thin and ultra-thin wafers.
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