Used KLA / TENCOR / THERMA-WAVE OP 2600 #293649607 for sale

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ID: 293649607
Film thickness measurement system.
KLA / TENCOR / THERMA-WAVE OP 2600 is a wafer testing and metrology equipment that enables rapid automotive and device qualification testing. It is designed to detect and identify defects in a variety of semiconductor wafers, as well as to measure and analyze them in detail. The system consists of an optical-lens array, dual-fourier analysis, and digital image correlation technology, allowing for faster and more accurate inspection of wafers at the nanoscale level. KLA OP 2600's optical-lens array is optimized to work and measure thin layers, as thin as 0.5 to 20 micrometers in thickness. This ensures that even the tiniest defects are detected with exceptional accuracy. The unit's dual-fourier analysis and digital image correlation technology then allow measurements to be made in both real-time and offline modes. This provides users with the ability to make quick, reliable decisions about wafer performance and quality. The machine's advanced imaging capability also provides users with the ability to accurately create an assessment of the overall device conformance. This is done by comparing measured results against customer specifications. TENCOR OP 2600 also features automated qualification/measurement setups and can set up a specific test in as little as five minutes. This automated testing process helps increase throughput, reduce cycle times, and lead to process improvement. The tool also features a proprietary wafer throughput calculation algorithm that enables automatic estimation of wafer cycle time, print count, and substrates. This helps ensure proper production processes and reduce waste caused by mistakes. THERMA-WAVE OP 2600 also comes with automatic defect identification and classification capabilities, which helps reduce time spent on initial defect investigation and minimizes false positives. This also helps to speed up visual inspection and more accurately diagnose wafers. Overall, OP 2600 is a powerful wafer testing and metrology asset that provides high-resolution, high-accuracy measurements and analysis of thin-layer devices. Its optical-lens array, dual-fourier analysis, and digital image correlation technology enable high-speed, reliable inspection and measurement of high-resolution details. Additionally, its automated testing capabilities help increase throughput, reduce cycle times, and improve overall process performance.
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