Used KLA / TENCOR / THERMA-WAVE Spectra FX 200 #9249271 for sale
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ID: 9249271
Wafer Size: 12"
Vintage: 2005
Film thickness measurement system, 12"
2005 vintage.
KLA / TENCOR / THERMA-WAVE Spectra FX 200 wafer testing and metrology equipment is an automated, non-contact metrology system designed for the measurement and analysis of thin film structures at the wafer level, enabling wafer-level optimization in sub-10 nanometers of resolution. It combines sophisticated inspection and testing capabilities with the precision metrology of interferometry. It consists of the following components: A Computerized Optics Unit (COS) that uses a multi-wavelength light source to measure and characterize the layer structure of various films on a wafer. This includes the ability to map surface features, material film thicknesses, opto-electronic properties, and material films of different thicknesses and diffusion coefficients. It has a wavelength coverage of 400 - 3200 nm, with a spectral resolution of up to 0.2 nm. A Wafer Mapping Machine (WMS) that uses a laser interferometry module to precisely measure and map the surface of a wafer. It can measure resistivity, film thickness, and diffusivity with a resolution down to 40 nanometers. It also has a high level of accuracy and repeatability, allowing for consistent measurements. A Process Analysis Tool (PAS) that provides detailed analysis of the data collected from the COS and WMS modules. It is able to provide detailed inspection of different films, and analysis of their thickness, composition, and material properties. It also offers quantitative analysis of film stress profiles, thickness, and other opto-electronic parameters. An Automated Semaphore Tracking Asset (ASTS) that assists the automated scanning model in navigating the wafer and providing feedback on the progress of the scan. This equipment includes a scan correction feature that allows for automatic compensation of any distortions due to non-ideal wafer alignments. KLA Spectra FX 200 system is ideal for applications such as advanced wafer inspection, advanced film and surface metrology, advanced materials metrology, and process qualification and validation. It is a reliable and cost-effective solution to providing wafer-level metrology solutions. This unit is designed with robust hardware and software to provide fast and accurate metrology results with minimal downtime.
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