Used KLA / TENCOR / THERMA-WAVE Therma-Probe 630 #9296387 for sale

KLA / TENCOR / THERMA-WAVE Therma-Probe 630 is a wafer testing and metrology equipment widely used in the semiconductor industry to measure electrical parameters of advanced device structures on wafers. This machine achieves the most accurate and precise electrical measurement results due to its advanced technological features. The system incorporates the latest advancement in automated optical probing technology, including a high-speed optical micro-probing solution with sensitivity at the nanoscale level and real-time non-contact measurements. KLA Therma-Probe 630 features high precision and accuracy, reliable measurements, and fast throughput even on complex structures. The wafer testing unit is designed to handle ICs ranging from 0.5 to 12 microns, wafers up to 150 and 200-millimeter wafers, and scales from 2 to 3 microns. The built-in metrology machine maintains a wafer surface temperature of -40ºC to +250ºC during testing, and the wafer can be moved linearly to any desired electrode site. The machine also offers an optional two-sided probe, allowing it to access the back side of the wafer. In order to ensure optimal performance and reliable linearity, the tool employs sophisticated signal processing circuitry and active temperature compensation techniques. TENCOR THERMAPROBE 630 integrates a field-programmable gate array (FPGA) processor for simultaneous parallel measurements. It also features a high-speed digital signal processor (DSP) for super-speed manipulation of data, and a programmable memory device for storing and retrieving data. The asset is also capable of performing self-monitoring tests, including measurements of leakage, on-state resistance, linearity, current-voltage curves, and junction capacitance. All of these tests are accomplished with minimal disturbance to the measurements. In addition, the model is equipped with advanced graphical user interface software (GUI) to aid in the data management and data analytics process. THERMA-WAVE Therma-Probe 630 is designed with many user-friendly features. For example, the wafers are automatically aligned, and the machine can be autonomous and switch between different test modes, from static test mode to dynamic test mode. It is also capable of applying different type of test structures, such as flip-chip, non-volatile memory (NVM), silicon on insulator (SOI), and biomemristor. The equipment is capable of performing multiple levels of testing, from on-wafer I/V (current/voltage) testing to yield estimation. It can also be adapted to parallel measurements on multiple wafers. In conclusion, THERMA-WAVE THERMAPROBE 630 is a highly advanced wafer testing and metrology system that can provide precise electrical measurements of wafers of different sizes and structures. It offers many advantageous features, such as high-precision and accuracy, fast throughput, and self-monitoring tests. In addition, its user-friendly features and easy data management capabilities make it suitable for any advanced wafer testing application.