Used LEITZ MPV-SP #9127939 for sale

ID: 9127939
Wafer Size: 8"
Film thickness measuring system, 8".
LEITZ MPV-SP is a wafer testing and metrology solution designed to provide highly accurate and reliable measurements of wafer thickness, resistivity, reflectance, and other physical characteristics. Built using the latest laser-based technology, the equipment offers superior accuracy and repeatability for thickness analysis in an automated, compact footprint, making it an ideal choice for small and medium sized wafer testing and metrology applications. The system utilizes a laser reflectometer to measure the properties of the wafer surfaces. It maps the wafer's surface topography using a beam of laser light which is reflected off the surface. The laser beam is focused by a microscope objective to a small spot on the sample, and the intensity of the reflected light is measured by the unit. The machine then calculates the parameters of interest based on the reflectivity of the sample. MPV-SP also incorporates automated wafer alignment capabilities to ensure accurate and repeatable measurements based on the size and shape of the wafer. It uses a patented three-dimensional vision tool to align the sample with the laser optics. The asset if programmed using a user-friendly software interface for easy operation and custom wafer programming of various parameters to suit the application. The model is capable of probing up to 15 wafers per minute, with a resolution of 0.1 μm. The thickness of the wafer can be analyzed with an accuracy of better than 1 micron. With an accuracies of better than 1 micron, the equipment can be used to detect surface defects such as pits, pitting, bumps, adhesions, and scratches. The reflected light from the surface can also be used to measure the reflectivity and resistivity of the wafer. LEITZ MPV-SP is designed to provide highly accurate and repeatable measurement of wafer thickness, resistivity, and reflectance. It is an ideal solution for small and medium sized wafer testing and metrology applications, providing superior accuracy in a compact and automated package.
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