Used RUDOLPH MetaPulse 200X-Cu #293664998 for sale

RUDOLPH MetaPulse 200X-Cu wafer testing and metrology equipment is the latest in a range of precision metrology solutions from RUDOLPH Technologies. This system provides the industries highest level of accuracy and reliability for surface profile and critical dimensions of wafers and substrates. RUDOLPH METAPULSE 200XCU is designed to allow fast and efficient evaluation of a wide range of critical dimensions and surface profiles. This unit utilizes a 1064nm wavelength laser profile interferometer, which enables exacting measurements on the finest features of high performance integrated circuits. This machine can measure with sub-Angstrom accuracy, allowing for precise results even at the nanometer level. The tool also features a powerful imaging algorithm, which can reconstruct profile images from complex surface features and generate 3D scans of the surface profile of the wafer. This can help ensure uniformity and consistency throughout the device with higher levels of accuracy and repeatability. Additionally, the asset's sensitivity is adjustable, making it versatile for different kinds of surface profiles and patterns. METAPULSE 200X CU offers a variety of sophisticated diagnostics to test the wafer structure from multiple angles. It is the only metrology model available today which integrates multiple critical measurements such as parameterization, imaging, data analysis and signal verification into a single equipment, allowing for rapid diagnostic analysis. The system is equally adept at monitoriing the effect of process conditions, chemicals or electrode-induced effects on the surface of a wafer. It can also measure surface roughness, particle contamination, and layer adhesion of any material, making it an invaluable tool in both research and manufacturing. METAPULSE 200 X CU is an essential choice for Quantum cascade laser, MEMS, and advanced high performance CMOS process development. It is a reliable and accurate metrology unit that provides essential data to help manufacturers maximize the yield of new devices while reducing costs and time to market.