Used RUDOLPH MetaPulse 200X-Cu #9238326 for sale

RUDOLPH MetaPulse 200X-Cu is a cutting edge wafer testing and metrology equipment designed to facilitate fast and reliable non-destructive wafer evaluation. This system offers a unique combination of comprehensive tools for surface and subsurface defect detection, cross-sectional metrology, and process control. The product is equipped with a full-featured Vision Robotic Substrate Handler (VRSH) which features an embedded pattern recognition unit and five-axis motion platform for automated handling of large wafers. The machine also integrates a high-performance out-of-plane optical metrology head with multi-layer optics for fast, accurate and non-destructive evaluation of wafer films and process features. The 200X-Cu uses advanced ultra-high vacuum systems and proprietary non-destructive imaging techniques to image defects and measure wafer parameters to sub-micron accuracy. This tool also features a high-precision stage control asset which is capable of precise placement of wafer samples in various positions and orientations for different measurements or experiments. In addition, the model can also be used to perform automated probing of wafer samples to detect surface and subsurface defects, and to measure the thickness and composition of films and topologies of specific microstructures. The 200X-Cu further integrates an array of advanced pattern recognition algorithms to detect variations in individual pixels and discern any pattern defects in the wafer. As a result, users can take proactive steps to correct any flaws within their processes. RUDOLPH METAPULSE 200XCU is an efficient wafer testing and metrology equipment designed to help users identify and address defects early in the production cycle. With efficient automation and high-precision wafer-handling technology, this system makes it easy to inspect and measure wafer characteristics quickly and accurately.