Used RUDOLPH MetaPulse 200X-Cu #9300364 for sale

RUDOLPH MetaPulse 200X-Cu
ID: 9300364
Wafer Size: 6"
Film thickness measurement system, 6".
RUDOLPH MetaPulse 200X-Cu is an advanced wafer testing and metrology equipment that is specifically designed for the needs of the manufacturing industry. It offers versatile and unrivalled measurement capabilities and stands out in accuracy, repeatability, and sensitivity during wafer inspection. The system utilizes patented 2D laser inspection - a method of inspecting the topography of a wafer surface that scans the surface in a non-contact manner with nanometric resolution. The results produced from this inspection are highly accurate, allowing users to remotely observe and measure the topography of a wafer, which allows for more consistent quality control. The advanced 2D laser technology also enables rapid detection of aberrations, such as scratches, on the surface of the wafer. RUDOLPH METAPULSE 200XCU features a high efficiency automated 3D wafer metrology unit, with an integrated machine for rapid measurements of length, radius, peak-to-valley, inclination, asymmetry, flatness, inductance, and other wafer parameters. This tool is capable of measuring up to 6 surfaces per second and is compliant with SEMI M1/M7 specifications for fast and accurate measurements across varying wafer sizes and shapes. Moreover, the asset incorporates the world's most advanced SONAR technology - an advanced, non-destructive method of measuring and mapping wafer profile shape and surface defects while concurrently measuring mass of the wafer. The model can also be employed to quantitatively measure, quantify, and observe wafer surface features, such as width, thickness, and deformation. Moreover, the equipment includes a high-precision, automated pattern recognition and recording system, which allows for the quick detection of high precision pattern defects, such as micro-cracks, trenches, and fine markings. This unit also ensures that other critical wafer parameters, such as flatness, symmetry, z-tilt, tilt, and roundness, can be monitored at the same time. In addition, the machine supports high-speed data transfer capabilities, allowing for data to be shared among multiple systems quickly and easily. This feature reduces the time taken for analysis and reporting to a matter of minutes, drastically speeding up the process of quality assurance. Overall, METAPULSE 200X CU is an advanced wafer testing and metrology tool that offers rapid detection of aberrations, accurate and repeatable measurements, and high speed data exchange. It is an ideal asset for manufacturing industry needs.
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