Used VEECO / SLOAN DEKTAK II #150012 for sale
VEECO / SLOAN DEKTAK II equipment is an advanced wafer testing and metrology tool used for the non-destructive characterization and measurement of wafers. This system is highly accurate and provides an integrated solution for wafer testing and metrology from a single platform. VEECO DEKTAK II unit is designed to perform multiple types of measurements including electron beam induced current (EBIC), conductivity, surface topography, surface profile and rugosity. It also offers a variety of scan modes including lateral, vertical and two-dimensional scans. The machine is capable of monitoring and analyzing surface features such as thin film features and defects in the wafer material. SLOAN DEKTAK II tool is equipped with a high-resolution stage which enables the user to measure nanometer scale features reliably and accurately. This asset is driven by an intuitive user interface which provides enhanced visibility to the sample surface. The user interface features a focus enhancement mode, automatic and manual alignment tools and an automatic wafer detection model. It also allows users to zoom in and out of the sample surface to perform detailed analysis. DEKTAK II equipment is based on a precise multi-axis motorized stage which enables the user to perform precise wafer measurements with the utmost accuracy. The system includes reliable stylus scanning sensors and vision sensors which are used for determining surface topography and sub-micron resolution measurements. Additionally, the unit allows the user to store acquired data for future use and download it for further analysis. Overall, VEECO / SLOAN DEKTAK II machine is a reliable and accurate tool for wafer testing and metrology applications. Its simple and intuitive user interface, precise stage and reliable sensors enable users to achieve unparalleled accuracy and repeatability in wafer measurements and analyses. VEECO DEKTAK II tool is designed to enable the user to measure nanometer scale features, analyze thin film features and accurately detect surface defects in the wafer material.
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