Used VEECO / SLOAN DEKTAK IIA #9289804 for sale

VEECO / SLOAN DEKTAK IIA is a sophisticated wafer testing and metrology equipment developed to increase the accuracy of surface and thin film metrology. Widely used in various semiconductor and research laboratories, VEECO DEKTAK IIA is capable of high resolution measurement of flat, stepped, and graduated surfaces. The wafer testing and metrology system is based on the principles of interferometry and uses an air-bearing stylus to map the surface of the wafer. The surface is scanned with a sensor located at the tip of the stylus, which measures the surface topography of the wafer. As the stylus moves over the wafer surface, the sensor takes thousands of data points at closely spaced intervals which are used to reconstruct a three-dimensional image of the wafer's surface. SLOAN DEKTAK IIA is equipped with several advanced features that make wafer testing and metrology more accurate. The unit uses advanced image analysis algorithms to identify features such as edges, corners, and line segments. It also comes with a high-resolution video microscope that can be used to view the wafer surface in great detail. Additionally, the machine can measure up to four datum points with a single scan, reduce multiple measurements to one average value, and analyze two-dimensional topographical distributions such as bumps, ridges, and valleys. DEKTAK IIA also integrates with a variety of materials testing instruments including scanning electron microscopes, Raman spectrometers, atomic force microscopes, and coordinate measuring machines. This allows for advanced wafer testing processes such as the measurement of surface roughness, the determination of coating thickness, and the calculation of bi-dimensional statistics. Overall, VEECO / SLOAN DEKTAK IIA is a reliable tool for precise wafer testing and metrology. With its high-resolution sensing capabilities and advanced image analysis algorithms, the wafer testing and metrology tool allows users to accurately measure surface topography and accurately characterize mechanical, physical, and chemical characteristics of wafer surfaces.