Used NOVELLUS Gamma 2100 #9228361 for sale

Manufacturer
NOVELLUS
Model
Gamma 2100
ID: 9228361
Wafer Size: 8"
Vintage: 2002
Asher, 8" (2) Wafer loaders for 8" Open cassette PATLITE WMEEN Signal tower (2) LCDSA141 Monitors (3) ADTEC AX-1000 II RF Generators MKS 325 ModuceII pirani vacuum tranducer MKS 153 Pressure control valve MKS 622 Pressure gauge (8) WATLOW 988 Series temperature controllers MFC: Model / Gas / Scale UFC-8160 / O2 / 5 L UFC-8160 / CF4 / 200 SCCM UFC-8160 / O2 / 5 L Power supply: 208 V, 60 A, 50/60 Hz, 3 Phase Hard Disk Drive (HDD) Missing 2002 vintage.
NOVELLUS Gamma 2100 is an etcher/asher developed by NOVELLUS Systems for IC packaging applications. It is a multi-process, single-chamber etcher/asher that uses inductively coupled plasma (ICP) etching and chemical vapor deposition (CVD) processes. Gamma 2100 can etch copper (Cu) or aluminum (Al) metallization layers and composite via-filling layers for high aspect ratio packages. NOVELLUS Gamma 2100 is capable of etching materials such as aluminum, titanium, nickel, gold, silver, alloys, and Cu-based materials for thin-film metallization structures. It can also be programmed for a range of process parameters, such as substrate temperature, RF frequency, RF power, and etchant flow rate, that optimize the etch rate and feature profile quality. Additionally, the ability to etch multiple layer structures in a single chamber allows for faster throughput. Gamma 2100 etcher/asher is equipped with a process chamber that includes two independent modules. The first module uses the ICP process to etch material layers. This process creates a high-temperature, high-density plasma source that etches material using cold plasma technology with a low temperature ICP source. The second module is used to deposit chemical vapor deposition (CVD) layers using silicon-based chemistry. This module also includes a standalone cold-wafer holder to facilitate co-planarization of CVD layers. NOVELLUS Gamma 2100 also has a hot zone that can be tailored for specific application processes. The hot zone can maintain various substrate temperatures to keep the etching process stable, while ensuring that the wafer remains flat during etching. The temperature of the hot zone is adjustable between 200°C and 500°C. Furthermore, the etcher/asher utilizes a fast load lock system that fully isolates the processing chamber from the environment and removes corrosive and hazardous materials for safe waste disposal. Additionally, Gamma 2100 can support up to five different etchant chemistries to etch various thin film structures. NOVELLUS Gamma 2100 etcher/asher is a user-friendly system that allows operators to quickly change programs and components to keep up with changing product demands. It is a reliable and highly accurate etching tool that offers high productivity and can meet the most demanding packaging requirements.
There are no reviews yet