Used DISCO DFG 8540 #293605712 for sale

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ID: 293605712
Vintage: 2015
Grinder 2015 vintage.
DISCO DFG 8540 is a professional-grade wafer grinding, lapping, and polishing equipment. It is designed for advanced high-precision and high-efficiency grinding, lapping, and polishing of wafers and other materials. The system features an automated feeder for feeding wafers into the grinding, lapping, and/or polishing table. This table is equipped with three distinct grinding, lapping, and polishing functions and is capable of processing up to 8 wafers simultaneously with repeatable accuracy and precision. The unit is designed to provide a high degree of accuracy and consistency of the grinding, lapping, and polishing process. The automated feeder contains a control machine which adjusts the grinding, lapping, and polishing tables to accurately and consistently process the wafers. The feeder also controls the grinding depth, grinding feed rate, and lap/polish pressure to ensure the best processing results. The grinding table is equipped with a special grinding tool designed to provide a consistent grinding motion even under high loads. The table is driven by a brushless motor, which provides excellent torque and speed control. The grinding tool is equipped with an adjustable speed range (from 100 to 12,000 rpm) which can be adjusted depending on the wafer type, the load on the abrasive tool, or the desired grinding surface quality. In addition, the grinding table is equipped with an automatic grinding force control, allowing for accurate grinding results in a wide range of grinding conditions. The lapping table is equipped with a variable-speed lap feed drive for precise control of the lap feed speed and variable abrasive pressure. This ensures that the abrasive used for the lapping is evenly distributed and the lapping surface remains flat. The table also contains an automatic slow-down safety feature to ensure a smooth lapping process. The polishing table is equipped with an independent motor that provides precise polishing control. The lapping table is made up of two parts: a "tailstock", which is an adjustable support device that helps to center the workpiece, and a "headstock", which is a holding device that compensates for differences in the workpiece's height. The headstock is adjustable to ensure the correct polishing pressure is applied on the entire surface of the wafer. DISCO DFG8540 is a versatile and powerful grinding, lapping, and polishing tool. It is ideal for handling wafers of any size, from large wafers to miniature ones, and for producing flat, smooth surfaces with high precision. It is highly customizable, allows for precise control over the grinding, lapping, and polishing process, and produces excellent results with minimal inputs.
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