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1317 RESULTS FOUND FOR: used Bonders

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  • THROUGH MILTON FENG :

    CASCADE MICROTECH / ALESSI 12000 Semiautomatic prober, 8" Configuration: Microchamber capability (1) MITUTOYO M Plan APO 10x / 0.28 objective lens (1) MITUTOYO M Plan APO 2x / 0.055 objective lens (2) MITUTOYO 10x / 24 eye pieces PANASONIC GP-KR222 color closed-circuit camera KINETIC SYSTEMS isolation bench Vibraplane 9101-02-22 optical table, 42 x 36 x 1" TEMPTRONIC TP031SB-TS-1 fluid heater, power supply and flow control PC with control software CASCADE MICROTECH card holder Holds card sizes 11.4 x 0.5 to 0.32 x 28.9 cm 2002 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC 2014 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.
  • AMICRA MICROTECHNOLOGIES: ADB 2000

    AMICRA MICROTECHNOLOGIES ADB 2000 Laser die bonder 2002 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC 2014 vintage.
  • ASM: EAGLE XTREME

    ASM Eagle Xtreme Wire bonder Bonding capabilities Bonding method: Thermosonic (TS) Au wire size: Standard: 0.5mil ~ 1.3mils Wire length: Maximum 8mm Bonding speed: 20 Wires / Sec for 2mm Bonding accurarcy: 2.0 pm @ 3 Sigma Bonding area: 56mm x 70mm PR Accuracy: ± 0.30 |jm Lead locator detection: 5ms / Lead Loop control: Programmable and auto loop XY Resolution: 50nm Z Resolution: 100nm Number of bonding wires: Up to 5000 Program storage: 30000 Programs on hard disk Transducer system: 138kHz (Standard) Applicable magazines: Length: 140-295mm (Standard) Height: 55-180mm Width: 16-100mm Applicable leadframes: L: 140-295mm (Standard) T: 0.1-0.8mm Magazine pitch: 2.4 - 10mm Programmable Device changeover: <5 Minutes between L/F types <4 Minutes with the same L/F type Number of buffered magazines: 2-3 Voltage: 100-240V Frequency: 50/60HZ Power consumption: Maximum 1500W 2011 vintage.
  • ASM: AD896-06

    ASM AD896-06 Wire bonder 2008 vintage.
  • ASM: AD 898

    ASM AD 898 Die bonder 2004 vintage.
  • ASM: AD830

    ASM AD830 Die bonder 2011 vintage.
  • ASM: AD 830

    ASM AD 830 Die bonder System accuracy: Die placement X-Y: ±1.5 mil (± 38.1 μm) @ 3σ Die rotation: ± 3° @ 3σ (Subject to PR template quality) (for die size >40mil) Machine cycle time: 200 min Material handling capability: Die size: 6 x 6 ~ 200 x 200 mil (150 x 150 ~ 5080 x 5080 mm) Lead frame size: Length: 3.15" ~ 10.24" (80 ~ 260 mm) Width: 0.5" ~ 2.95" (12.7 ~ 75 mm) Height: 3 ~ 30 mil (0.12 ~ 0.76 mm) Magazine size: Length: 3.15" ~ 11" (80 ~ 280 mm) Width: 0.71" ~ 3.15" (18 ~ 80 mm) Height: 2.68" ~ 7.48" (68 ~ 190 mm) Bond head: X-Resolution: 0.007 mil (0.2 μm) Y-Resolution: 0.02 mil (0.5 μm) Z-Resolution: 0.02 mil (0.5 μm) Vision system: PR System: 256 Grey levels Resolution: 480 x 480 pixel PR Accuracy: ± 1/4 pixel (±1 μm @ FOV 2mm) Angle accuracy: ± 0.1° Work holder: Track width: 0.5" ~ 2.95" (12.7 ~ 75mm) Wafer table: Wafer handling: Maximum 8" wafer Auto alignment: ±10° Range, 0.001875° / Step Facilities required: Voltage: Option 110 / 200 / 220 / 240 VAC (Machine) Frequency: 50/60 Hz Compressed air: Minimum 5 bar (71 PSI) Power consumption: Approximate 2500 W (Machine) 2010 vintage.
  • ASM: AD 898

    ASM AD 898 Die bonders 2005 vintage.
  • ASM: AD 898

    ASM AD 898 Die bonders 2005 vintage.
  • ASM: AD 898

    ASM AD 898 Die bonders 2005 vintage.
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