Bonders

CASCADE MICROTECH / ALESSI 12000 Semiautomatic prober, 8" Configuration: Microchamber capability (1) MITUTOYO M Plan APO 10x / 0.28 objective lens (1) MITUTOYO M Plan APO 2x / 0.055 objective lens (2) MITUTOYO 10x / 24 eye pieces PANASONIC GP-KR222 color closed-circuit camera KINETIC SYSTEMS isolation bench Vibraplane 9101-02-22 optical table, 42 x 36 x 1" TEMPTRONIC TP031SB-TS-1 fluid heater, power supply and flow control PC with control software CASCADE MICROTECH card holder Holds card sizes 11.4 x 0.5 to 0.32 x 28.9 cm 2002 vintage.

K&S 4124 Ball bonder, has negative EFO, 2" wire feed, ~1990's vintage.

K&S 4124 Ball bonder, has negative EFO, 2" wire feed, ~1990's vintage.

K&S 4124 Ball bonder, has negative EFO, 2" wire feed, ~1990's vintage.

ADT / K&S 4123 Wedge bonder.

ADT / K&S 4523 Wire bonder Heated work holder (2) OLYMPUS GSWH 10x/22 lenses (2) OLYMPUS GSWH 20x/12.5 lenses SCHOTT FOSTEC 20500 fiber optic illuminator with ring light 2001 vintage.

K&S 1474FP Automatic wedge bonder 7 wire bond head Flat board loader / unloader Software version: 8-60-2-24G USG data sheet MDP file diskette Spare power supply.

ADT / K&S 4526 Wire bonder.

K&S 8090 Aluminum wedge wire bonder.

K&S 4524 Wire bonder.

K&S 4523 Wire bonder Heated holder (2) OLYMPUS GSWH 10x/22 lenses (2) OLYMPUS GSWH 20x/12.5 lenses SCHOTT FOSTEC 20500 fiber optic illuminator with ring light 2001 vintage.

ALPHASEM E 8003 clip bonder 164-228V / 328-456V, 3Ph, 5 wires, 50/60Hz, 12.5A Approx. weight: 1500Kg 2000 vintage.

AMICRA AFC Plus Flip chip bonders 75 W laser with simple shaping line lens Flipping unit: Rotation stage (180° movement), Z-stage Shielding gas unit: heated gas jet stream Heater control unit (4) Bond tools with heater (4) Bond tool holders.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.

ANORAD: FCB 5300 modified die bonder with ANORAD pression placement linear slides, quick draw conveyor, barcode reader, flat screen monitor, industral computer. Includes 1 Oneac power line conditioner.

APPLIED MATERIALS P 5000 Mark II Plasma etcher Previously used as a P 5000 W CVD system Previous processes run: Oxide, poly Gas configuration: CHF3 - HE/O2 - He- SF6 - CL2 - HBR - O2 - CF4 Includes: Main frame (2) Mark II etch chambers ALCALTEL 2033 and 2063 pumps Software version: 4.2.6 Load lock 1994 vintage.

ASM AB 530 Wedge bonder.

ASM AB 339 Wire bonders.