Bonders

CASCADE MICROTECH / ALESSI 12000 Semiautomatic prober, 8" Configuration: Microchamber capability (1) MITUTOYO M Plan APO 10x / 0.28 objective lens (1) MITUTOYO M Plan APO 2x / 0.055 objective lens (2) MITUTOYO 10x / 24 eye pieces PANASONIC GP-KR222 color closed-circuit camera KINETIC SYSTEMS isolation bench Vibraplane 9101-02-22 optical table, 42 x 36 x 1" TEMPTRONIC TP031SB-TS-1 fluid heater, power supply and flow control PC with control software CASCADE MICROTECH card holder Holds card sizes 11.4 x 0.5 to 0.32 x 28.9 cm 2002 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC.

AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC 2014 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC.

AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder 2011 vintage.

AMICRA MICROTECHNOLOGIES ADB 2000 Laser die bonder 2002 vintage.

AMICRA MICROTECHNOLOGIES Nova Plus Bonder Need service: KT 21739 Power supply, 48-55V, 10A KT 19056 Buffer module KT 16167 Power supply, 24V, 4.2A KT 16166 Power supply, 12V, 4.2A (4) KT 10115 Acopos servo amplifiers Power supply for PC 2014 vintage.

ASM Eagle Xtreme Wire bonder Bonding capabilities Bonding method: Thermosonic (TS) Au wire size: Standard: 0.5mil ~ 1.3mils Wire length: Maximum 8mm Bonding speed: 20 Wires / Sec for 2mm Bonding accurarcy: 2.0 pm @ 3 Sigma Bonding area: 56mm x 70mm PR Accuracy: ± 0.30 |jm Lead locator detection: 5ms / Lead Loop control: Programmable and auto loop XY Resolution: 50nm Z Resolution: 100nm Number of bonding wires: Up to 5000 Program storage: 30000 Programs on hard disk Transducer system: 138kHz (Standard) Applicable magazines: Length: 140-295mm (Standard) Height: 55-180mm Width: 16-100mm Applicable leadframes: L: 140-295mm (Standard) T: 0.1-0.8mm Magazine pitch: 2.4 - 10mm Programmable Device changeover: <5 Minutes between L/F types <4 Minutes with the same L/F type Number of buffered magazines: 2-3 Voltage: 100-240V Frequency: 50/60HZ Power consumption: Maximum 1500W 2011 vintage.

ASM AD896-06 Wire bonder 2008 vintage.

ASM AD 898 Die bonder 2004 vintage.

ASM AD830 Die bonder 2011 vintage.

ASM AD 830 Die bonder System accuracy: Die placement X-Y: ±1.5 mil (± 38.1 μm) @ 3σ Die rotation: ± 3° @ 3σ (Subject to PR template quality) (for die size >40mil) Machine cycle time: 200 min Material handling capability: Die size: 6 x 6 ~ 200 x 200 mil (150 x 150 ~ 5080 x 5080 mm) Lead frame size: Length: 3.15" ~ 10.24" (80 ~ 260 mm) Width: 0.5" ~ 2.95" (12.7 ~ 75 mm) Height: 3 ~ 30 mil (0.12 ~ 0.76 mm) Magazine size: Length: 3.15" ~ 11" (80 ~ 280 mm) Width: 0.71" ~ 3.15" (18 ~ 80 mm) Height: 2.68" ~ 7.48" (68 ~ 190 mm) Bond head: X-Resolution: 0.007 mil (0.2 μm) Y-Resolution: 0.02 mil (0.5 μm) Z-Resolution: 0.02 mil (0.5 μm) Vision system: PR System: 256 Grey levels Resolution: 480 x 480 pixel PR Accuracy: ± 1/4 pixel (±1 μm @ FOV 2mm) Angle accuracy: ± 0.1° Work holder: Track width: 0.5" ~ 2.95" (12.7 ~ 75mm) Wafer table: Wafer handling: Maximum 8" wafer Auto alignment: ±10° Range, 0.001875° / Step Facilities required: Voltage: Option 110 / 200 / 220 / 240 VAC (Machine) Frequency: 50/60 Hz Compressed air: Minimum 5 bar (71 PSI) Power consumption: Approximate 2500 W (Machine) 2010 vintage.

ASM AD 898 Die bonders 2005 vintage.

ASM AD 898 Die bonders 2005 vintage.

ASM AD 898 Die bonders 2005 vintage.