Wafer Steppers

NIKON NSR 2205 i11D Stepper.

NIKON NSR 2005 i8A Stepper 1993 vintage.

NIKON NSR 2005 i8A Stepper 1993 vintage.

NIKON NSR 2005 i8A Stepper 1993 vintage.

NIKON NSR 2005 i8A Stepper 1993 vintage.

NIKON NSR 2005 i8A Stepper 1993 vintage.

NIKON NSR 2005 i8A Stepper 1993 vintage.

NIKON NSR 2005 i8A Stepper 1993 vintage.

NIKON NSR 2205 i12D i-Line stepper.

APPLIED MATERIALS Wide body Load Lock, 6"-8", as-is.

APT 280AN Gallium Arsenide Wafer Titler, 3"-5" Exposes up to 16 easy to read alphanumeric characters across the wafer flat or at 3 other selectable locations in 90 degree increments from the flat.

ASML 5000 / 55 Stepper, 6", can be inspected, currently located in a fab and powered off.

ASML PAS 5500 / 80 Stepper, 8" Missing parts : Wafer Handling, Delta Electronica, AIRCO module Defective parts : various auxiliary cabinet electrical parts ================================================================================ ## PM MONTHLY avec/sans CHGT LAMPE ================================================================================ AUTHOR : XXXXXX VERSION : 11/05/2004 STEPPER : I-line ##============================================================================== ## Preventive Maintenance CHECKLIST ##============================================================================== ## ## Badge status Ws Retry ## ## Back-up Machines Constants on hd ls45 done ## Changement de lampe SI dans le planning na ## Nettoyage WH ls45 done ## Nettoyage RH ls45 done ## Controle Tower Lamp ls45 done ## Controle Ozoniser Lamp ls45 done ## Verification Tcu fait par tob ## Verification Mark Sensor ls45 done y - ## Verification Edge Sensor ls45 done y - ## Verification Illumination ls45 done y - ## Verification Dose repro (si lampe changee) na ## Verification Chuckspot ls45 done y - ## Verification Height & Tilt ls45 done y - ## Verification Tilt to tilt ls45 done y - ## Verification FEM ls45 done y - ## Verification Field Matching ls45 done y 2 ## Verification CD Matching fait par tpm svg ## Execution Back up des MCs sur hd ls45 done ## Execution Reboot ls45 done ================================================================================ ## Commentaires ##============================================================================== ## ## ## ## Tous les commentaires doivent etre rentres dans WS. Pour cela, utiliser la commande ENHA et attacher le commentaire a l'event de debut, milieu ou fin de PM. ================================================================================ Preventive Maintenance REPORTS ================================================================================ -------------------------------------------------------------------------------- Back-up Machines Constants on Tape -------------------------------------------------------------------------------- 12/15/2008 22:06:32 Machine:4419 (Rel:8.9.0.c, MCST [20125], MCMA_step.c, 1516) OK All Machine Constants are backed up to file: MC/4419_ALL_machine.const.2008_12_15.22h06m32.tgz -------------------------------------------------------------------------------- Cleaning Wafer Handling -------------------------------------------------------------------------------- done -------------------------------------------------------------------------------- Cleaning Reticle Handling -------------------------------------------------------------------------------- done -------------------------------------------------------------------------------- Controle Tower Lamp -------------------------------------------------------------------------------- done -------------------------------------------------------------------------------- Controle Ozoniser lamp -------------------------------------------------------------------------------- done -------------------------------------------------------------------------------- Tcu ------------------------------------------------------------------------------- fait par tob -------------------------------------------------------------------------------- Mark Sensor -------------------------------------------------------------------------------- Operator:ASM Machine:4419 Release:8.9.0 Date:12/15/2008 Time:22:35 Wafer handling reproducibility test TEST : Mark Repro Initial use of Indexers Indexer 1 : Not used Indexer 2 : Not used Indexer 3 : Input Indexer 4 : Output Wafertrack input : N Wafertrack output : N Integrity Option : None Number of batches : 1 Wafers per batch : 20 Prealignment data Prealignment mode used : 0 Wafer standard : SEMI Notch Prealignment mode : Fallback Nominal WCS Theta [rad] : 0.00000 Mark 1 [mm] X : 80.0000 Y : 0.0000 Mark 2 [mm] X : 80.0000 Y : 0.0000 Alignment data Do zero aligns : N Focus offset [um] : 0.0000 Alignment Mark 1 [mm] X : 80.0000 Y : 0.0000 Alignment Mark 2 [mm] X : -80.0000 Y : 0.0000 Reticle id : * Test result : OK +------------------------------------------------------------------------+ | Errors during test | +------------------------------------------------------------------------+ +========================================================================+ | No errors | +------------------------------------------------------------------------+ Results for all wafers and batches +-------+-------+-----------------------+------------------------------------+ | | | Prealign offset | Alignment wafer-to-stage offset | | | +-----------+-----------+-----------+-----------+------------+ | Batch | Wafer | X [um] | Y [um] | X [um] | Y [um] | Rot [urad] | +=======+=======+===========+===========+===========+===========+============+ | 1 | 1 | 11.02 | 44.77 | -2.26 | -0.56 | -6.06 | | 1 | 2 | 20.48 | -47.28 | -1.34 | -0.38 | -1.11 | | 1 | 3 | 16.17 | -49.18 | -1.62 | -1.40 | -0.17 | | 1 | 4 | 29.03 | -59.71 | -1.24 | -1.00 | -11.67 | | 1 | 5 | 7.63 | 24.76 | -1.48 | -0.96 | -3.92 | | 1 | 6 | -0.33 | 48.42 | -1.41 | -1.90 | -10.55 | | 1 | 7 | 169.36 | 90.31 | -1.08 | -1.54 | -16.59 | | 1 | 8 | 2.83 | 34.78 | -1.31 | -0.56 | 11.19 | | 1 | 9 | 2.73 | 46.19 | -1.29 | -1.47 | 0.39 | | 1 | 10 | 7.75 | 19.02 | -1.28 | -2.86 | -34.52 | | 1 | 11 | 3.42 | 28.45 | -1.98 | -1.08 | -3.43 | | 1 | 12 | 6.89 | 33.89 | -1.09 | -1.45 | -16.25 | | 1 | 13 | 7.69 | 39.76 | -1.42 | -2.10 | -24.26 | | 1 | 14 | 4.93 | 40.01 | -1.60 | -2.27 | -3.51 | | 1 | 15 | 8.39 | 33.21 | -0.95 | -1.42 | -5.83 | | 1 | 16 | 3.94 | 42.95 | -1.11 | -2.14 | -8.81 | | 1 | 17 | 6.62 | 40.78 | -1.32 | -0.85 | -13.55 | | 1 | 18 | 7.76 | 43.12 | -1.22 | -1.77 | -23.99 | | 1 | 19 | 13.35 | 39.36 | -1.24 | -2.21 | -24.99 | | 1 | 20 | 11.30 | 42.55 | -1.18 | -1.90 | -4.52 | +-------+-------+-----------+-----------+-----------+-----------+------------+ Computed results for all the processed wafers +---------------+-----------+-----------+-----------+-----------+-----------+ | | X offs | Y offs | X align | Y align | Rotation | | | [um] | [um] | [um] | [um] | [urad] | +===============+===========+===========+===========+===========+===========+ | Minimum | -0.33 | -59.71 | -2.26 | -2.86 | -34.52 | | Maximum | 169.36 | 90.31 | -0.95 | -0.38 | 11.19 | | Mean | 17.05 | 26.81 | -1.37 | -1.49 | -10.11 | | Std. Dev. | 36.48 | 36.73 | 0.31 | 0.66 | 10.86 | +---------------+-----------+-----------+-----------+-----------+-----------+ --------------------------------------------------------------------------------Edge Sensor -------------------------------------------------------------------------------- Operator:ASM Machine:4419 Release:8.9.0 Date:12/15/2008 Time:22:50 Wafer handling reproducibility test TEST : Edge Sensor Repro Initial use of Indexers Indexer 1 : Not used Indexer 2 : Not used Indexer 3 : Output Indexer 4 : Input Wafertrack input : N Wafertrack output : N Integrity Option : None Number of batches : 1 Wafers per batch : 20 Prealignment data Prealignment mode used : 0 Wafer standard : SEMI Notch Prealignment mode : Edge Sensor Nominal WCS Theta [rad] : 0.00000 Alignment data Do zero aligns : N Focus offset [um] : 0.0000 Alignment Mark 1 [mm] X : 80.0000 Y : 0.0000 Alignment Mark 2 [mm] X : -80.0000 Y : 0.0000 Reticle id : * Test result : OK +------------------------------------------------------------------------+ | Errors during test | +------------------------------------------------------------------------+ +========================================================================+ | No errors | +------------------------------------------------------------------------+ Results for all wafers and batches +-------+-------+-----------------------+------------------------------------+ | | | Prealign offset | Alignment wafer-to-stage offset | | | +-----------+-----------+-----------+-----------+------------+ | Batch | Wafer | X [um] | Y [um] | X [um] | Y [um] | Rot [urad] | +=======+=======+===========+===========+===========+===========+============+ | 1 | 1 | -44.28 | 49.17 | 5.94 | -4.63 | 52.19 | | 1 | 2 | -23.34 | -40.52 | 5.69 | -1.03 | 1.66 | | 1 | 3 | -36.41 | -35.89 | 6.27 | -4.98 | -18.16 | | 1 | 4 | -45.81 | 62.93 | 5.37 | -2.38 | -29.39 | | 1 | 5 | -38.24 | 25.09 | 5.60 | -2.13 | -7.58 | | 1 | 6 | -47.45 | 31.97 | 6.29 | -4.21 | -18.44 | | 1 | 7 | -44.30 | 55.95 | 5.33 | -4.23 | 2.75 | | 1 | 8 | -44.11 | 59.42 | 7.64 | -3.41 | 43.96 | | 1 | 9 | -45.58 | 69.58 | 6.15 | -1.82 | 12.57 | | 1 | 10 | -47.98 | 75.50 | 5.49 | -2.76 | 84.34 | | 1 | 11 | -48.44 | 66.77 | 7.31 | -4.59 | -57.11 | | 1 | 12 | -47.24 | 75.40 | 5.78 | -2.12 | 26.15 | | 1 | 13 | -49.07 | 83.95 | 6.36 | -2.61 | 22.29 | | 1 | 14 | -52.23 | 74.07 | 6.19 | -4.84 | 80.63 | | 1 | 15 | -43.81 | 64.26 | 5.81 | -3.34 | -21.00 | | 1 | 16 | -50.21 | 79.99 | 6.41 | -2.75 | 41.54 | | 1 | 17 | -47.76 | 55.65 | 6.70 | -4.50 | 44.64 | | 1 | 18 | -47.06 | 64.97 | 5.74 | -3.70 | 56.08 | | 1 | 19 | -52.90 | 86.77 | 5.28 | -2.49 | 47.98 | | 1 | 20 | -46.99 | 58.99 | 5.14 | -4.94 | 11.50 | +-------+-------+-----------+-----------+-----------+-----------+------------+ Computed results for all the processed wafers +---------------+-----------+-----------+-----------+-----------+-----------+ | | X offs | Y offs | X align | Y align | Rotation | | | [um] | [um] | [um] | [um] | [urad] | +===============+===========+===========+===========+===========+===========+ | Minimum | -52.90 | -40.52 | 5.14 | -4.98 | -57.11 | | Maximum | -23.34 | 86.77 | 7.64 | -1.03 | 84.34 | | Mean | -45.16 | 53.20 | 6.02 | -3.37 | 18.83 | | Std. Dev. | 6.48 | 34.86 | 0.65 | 1.20 | 37.78 | +---------------+-----------+-----------+-----------+-----------+-----------+ ------------------------------------------------------------------------------- Uniformity -------------------------------------------------------------------------------- Operator:ASM Machine:4419 Release:8.9.0 Date:12/15/2008 Time:22:17 Uniformity Measurement Comment : Image Field Size [mm] x : 21.0 y : 21.0 Diameter : 29.7 Steps x : 11 y : 11 Measurement Type : Sample Mode Lamp Power [W] : 1000.0 Samples per Position : 50 Apply REMA Window : Yes Load Reticle : N Uniformity Measurement Result Uniformity [%] : 1.81 Logfile : LI/LIUM/waf.1214 Number of valid measurements : 121 Tilt X [%/field] : 0.28 Y [%/field] : -1.12 Overall Average of Ratio : 1.00 Standard Deviation : 0.01 Intensities Spot Sensor [mW/cm2] : 492.31 Standard Deviation : 4.56 Intensities Energy Sensor [mW/cm2] : 493.12 Standard Deviation : 0.26 Lamp Time Lit [hour] : 790:24 Estimated Uniformity from measured data [%] If corrected for actual tilts : 1.67 If corrected with gradient filter : 1.59 If corrected for tilts and with gradientfilter : 1.37 Symmetric Uniformity Value [%] : -0.88 -------------------------------------------------------------------------------- Chuckspot -------------------------------------------------------------------------------- Si chuckspot prÈsent, indiquer le(s) champs: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 n -------------------------------------------------------------------------------- Height & Tilt -------------------------------------------------------------------------------- IS-White Level Sensor Tilt Offset - Metrology Calibration Operator:ASM Machine:4419 Release:8.9.0 Date:12/15/2008 Time:23:07 Define IS-White Level Sensor Tilt Offset Measure Results Tilt Rx [urad] Mean : -39.1 St. dev. : 0.3 Tilt Ry [urad] Mean : 98.9 St. dev. : 0.3 IS-White Level Sensor Tilt Offset Tilt Rx [urad] Current : -37.8 New : -39.1 Tilt Ry [urad] Current : 99.6 New : 98.9 Exposure Report Operator:ASM Machine:4419 Release:8.9.0 Date:12/15/2008 Time:23:13 Focus/Exposure Matrix Test Purpose : White Level Sensor Tilt Calibration Input Parameters Configuration : White Level Sensor Focus Mode : Closed Loop Mode Matrix Size X : 5 Y : 11 Step Increment [um] X : 300.0 Y : 300.0 Focus [um] Nominal : 0.00 Step : 0.20 Energy [mJ/cm2] Nominal : 174.0 Step : 5.0 Reticle ID : RESOL05B959 Reticle Pitches [mm] 1 : 52.050 2 : 52.050 3 : 66.050 Masking Window Size [mm] X : 110.00 Y : 138.00 Dies Exposed : C FEM Flatness Criterion : 0.30 Die Tilt Correction : N Expose SEM Reference Marks : N Lens Number : Energy To Clear Array : N Matrix Centres +----------+----------+ | X | Y | | [mm] | [mm] | +==========+==========+ | 0.000 | 0.000 | +----------+----------+ Wafer ID: 1 Temperature of Lens [degC] : 21.99 Pressure in Lens [mbar] : 990.96 flat edge/nodge Offset [um] : ____.___ Offset [um] : ____.___ Tilt X [urad] : ____.___ Tilt X [urad] : ____.___ Tilt Y [urad] : ____.___ Tilt Y [urad] : ____.___ Max Diff [um] : ____.___ Max Diff [um] : ____.___ 4 X ____.__ 8 X ____.__ 3 X ____.__ 4 X ____.__ 8 X ____.__ 3 X ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ 5 X ____.__ 0 X ____.__ 7 X ____.__ 5 X ____.__ 0 X ____.__ 7 X ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ 1 X ____.__ 6 X ____.__ 2 X ____.__ 1 X ____.__ 6 X ____.__ 2 X ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ C Offset [um] : 0.168 Tilt X [urad] : 5.388 Tilt Y [urad] : -3.522 Max Diff [um] : 0.249 2 X 10.41 6 X 0.00 1 X -10.41 Y -10.41 Y -13.21 Y -10.41 Z -17.09 Z -17.49 Z -18.14 dZ 0.25 dZ 0.26 dZ 0.30 7 X 10.41 0 X 0.00 5 X -10.41 Y 0.00 Y 0.00 Y 0.00 Z -17.78 Z -18.44 Z -18.84 dZ 0.12 dZ 0.00 dZ 0.14 3 X 10.41 8 X 0.00 4 X -10.41 Y 10.41 Y 13.21 Y 10.41 Z -18.36 Z -19.00 Z -19.31 dZ 0.08 dZ 0.13 dZ 0.23 Offset [um] : ____.___ Offset [um] : ____.___ Tilt X [urad] : ____.___ Tilt X [urad] : ____.___ Tilt Y [urad] : ____.___ Tilt Y [urad] : ____.___ Max Diff [um] : ____.___ Max Diff [um] : ____.___ 4 X ____.__ 8 X ____.__ 3 X ____.__ 4 X ____.__ 8 X ____.__ 3 X ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ 5 X ____.__ 0 X ____.__ 7 X ____.__ 5 X ____.__ 0 X ____.__ 7 X ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ 1 X ____.__ 6 X ____.__ 2 X ____.__ 1 X ____.__ 6 X ____.__ 2 X ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Y ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ Z ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ dZ ____.__ Points du Height&Tilt : 0 :-0.3 1 :-0.08 2 :-0.36 3 :-0.46 4 :-0.18 5 :-0.2 7 :-0.3 FPD :0.38 FC :0.03 -------------------------------------------------------------------------------- tilt to tilt -------------------------------------------------------------------------------- Model - Metrology Calibration/Match Stone to Lens Tilt; Level Sensor Tilt Operator:ASM Machine:4419 Release:8.9.0 Date:12/15/2008 Time:23:32 Tilt To Tilt matching -Modelling Measurement info Testlog : 4419 Date : Mon Dec 15 23:28:00 2008 Machine ID : 4419 Number of Wafers : 1 MCC Threshold : 0.00 Comment : Number of Wafers Rejected : 0 Reproducability tilt calibration stdev STOLE Rx [urad] : 0.0 stdev STOLE Ry [urad] : 0.0 stdev LS Rx [urad] : 0.0 stdev LS Ry [urad] : 0.0 Stone to Lens Tilt Old STOLE Rx [urad] : -52.7 STOLE Ry [urad] : -52.4 New STOLE Rx [urad] : -53.1 STOLE Ry [urad] : -50.1 Delta STOLE Rx [urad] : -0.4 STOLE Ry [urad] : 2.3 Level Sensor Tilt Old LS Rx [urad] : -75.8 LS Ry [urad] : -50.9 New LS Rx [urad] : -75.8 LS Ry [urad] : -50.9 Delta LS Rx [urad] : 0.0 LS Ry [urad] : 0.0 Model results per wafer +-----+--------+--------+--------+--------+---------+ |Wafer|STOLE Rx|STOLE Ry| LS Rx | LS Ry | MCC | | | [urad] | [urad] | [urad] | [urad] | | +=====+========+========+========+========+=========+ | 1 | -53.1 | -50.1 | -75.8 | -50.9 | 0.91 | +-----+--------+--------+--------+--------+---------+ -------------------------------------------------------------------------------- FEM -------------------------------------------------------------------------------- (penser a copier le report en allant dans: view test report/ Projection System /FEM developper custumer) focus=-0.2 -------------------------------------------------------------------------------- Field Matching -------------------------------------------------------------------------------- Data Modelling - Metrology Calibration/Machine Matching/Field Matching Operator:ASM Machine:4419 Release:8.9.0 Date:12/16/2008 Time:00:22 Machine to Machine Matching Exposure Layer : --- First --- : --- Second --- Date/Time : Wed Aug 9 23:05:57 2000 : Mon Dec 15 23:49:41 2008 Machine ID : 8317 : 4419 Reticle ID : 45440251DUV : MATCH5X0APAJ Reference Grid : : Matching set ID : DEFAULT : ORIGINAL Reticle Alignment : TTL Align : TTL Align Wafer Alignment : TTL Align : TTL Align Lens Type : 70 : 74 Lens ID : 0111654a : Energy [mJ/cm2] : 18.0 : 191.0 Focus Offset [um] : 0.00 : 0.00 Illumination Mode : Default : Conventional Blade ID : : Numerical Aperture : 0.66 : Sigma Inner : 0.00 : Sigma Outer : 0.65 : Temperature [degC] : 22.0 : 22.0 Pressure [mbar] : 992.5 : 991.0 Wavelength [nm] : 248.305 : 365.000 Comments from: 'Exposure First Layer' : 'Exposure Second Layer' : 'Measure Mark Positions' : 'XY-Imaging Modelling' : Test Log Name : XYM_4419_8317.tlg Optimization Method : Least-Squares Number of Wafers : 1 Number of Rejected Wafers : 0 Number of Fields per Wafer : 12 Number of Marks per Field : 17 Alignment Errors in Data : 0 Max Field Size X [mm] : 21.0 Y [mm] : 27.4 Wafer/Field/Mark Selection : *:*:* Align. Errors in Selection : 0 Overlay Mode : Second to First Set Threshold : OFF Reticle data used : Reticle data from testlog Reticle layout used : 4X_OV759_28R6_ASM80 ============================================================================== Overlay Error for this Batch: +------------------+-----------------------------+ | | Filtered Overlay Error | | +---------+---------+---------+ | | X | Y | Vector | | | [nm] | [nm] | [nm] | +==================+=========+=========+=========+ | Mean | 16.3 | -6.4 | | | St. Dev. | 32.5 | 38.2 | | | |Mean| + 3 Sigma | 113.9 | 121.0 | | | Maximum 99.7% | 76.9 | 93.6 | 109.9 | +------------------+---------+---------+---------+ Maximum Overlay Error positions for this Batch: +------+----------+---------+----------+-------------------------------+ | | | | |Corresponding Position in Field| | | | | +---------------+---------------+ | Nr | Max DX | Stdev | DY | X | Y | | | [nm] | [nm] | [nm] | [mm] | [mm] | +======+==========+=========+==========+===============+===============+ | 1 | 60.3 | 12.5 | 70.7 | 8.640 | -8.640 | | 2 | 58.5 | 14.3 | 46.0 | -4.320 | -4.320 | | 3 | 57.8 | 15.5 | 4.2 | -4.320 | -0.000 | | 4 | 51.2 | 12.7 | 15.8 | -8.640 | -0.000 | | 5 | 39.7 | 20.2 | 36.5 | 8.640 | 8.640 | | 6 | 35.6 | 12.6 | 38.3 | -8.640 | 8.640 | | 7 | 31.5 | 18.0 | 40.8 | -4.320 | 4.320 | | 8 | 26.9 | 13.4 | 26.6 | -0.000 | -8.640 | | 9 | 25.6 | 20.1 | 25.9 | -8.640 | -8.640 | | 10 | 20.8 | 11.5 | 34.2 | -0.000 | -4.320 | +------+----------+---------+----------+---------------+---------------+ +------+----------+---------+----------+-------------------------------+ | | | | |Corresponding Position in Field| | | | | +---------------+---------------+ | Nr | Max DY | Stdev | DX | X | Y | | | [nm] | [nm] | [nm] | [mm] | [mm] | +======+==========+=========+==========+===============+===============+ | 1 | 70.7 | 19.1 | 60.3 | 8.640 | -8.640 | | 2 | 54.3 | 14.8 | 10.3 | -0.000 | 4.320 | | 3 | 50.2 | 19.1 | 12.9 | 4.320 | 4.320 | | 4 | 46.0 | 18.0 | 58.5 | -4.320 | -4.320 | | 5 | 40.8 | 14.9 | 31.5 | -4.320 | 4.320 | | 6 | 38.3 | 14.4 | 35.6 | -8.640 | 8.640 | | 7 | 36.5 | 17.6 | 39.7 | 8.640 | 8.640 | | 8 | 34.2 | 16.6 | 20.8 | -0.000 | -4.320 | | 9 | 33.5 | 17.9 | 15.9 | 8.640 | -0.000 | | 10 | 26.6 | 14.8 | 26.9 | -0.000 | -8.640 | +------+----------+---------+----------+---------------+---------------+ Intrafield Overlay Error Classification: +------------------------------+---------------------+---------------------+ | | Model Parameters |Max. Resulting Errors| | +----------+----------+----------+----------+ | | Mean |Std. Dev. | Mean |Std. Dev. | | | | | [nm] | [nm] | +==============================+==========+==========+==========+==========+ | Translation in X [um] | 0.016 | 0.014 | 16.3 | 13.7 | | Translation in Y [um] | -0.006 | 0.015 | -6.4 | 14.7 | | Rotation [urad] | -0.384 | 0.349 | -5.7 | 5.2 | | Magnification [ppm] | 0.189 | 0.365 | 2.8 | 5.4 | | 3rd Order Dist. [nm/cm3] | | | | | | Asymm. Rotation [urad] | | | | | | Asymm. Magnification [ppm] | | | | | +------------------------------+----------+----------+----------+----------+ Interfield Overlay Error Classification: +------------------------------+---------------------+---------------------+ | | Model Parameters |Max. Resulting Errors| | +----------+----------+----------+----------+ | | Mean |Std. Dev. | Mean |Std. Dev. | | | | | [nm] | [nm] | +==============================+==========+==========+==========+==========+ | Translation in X [um] | 0.016 | 0.000 | 16.3 | 0.0 | | Translation in Y [um] | -0.006 | 0.000 | -6.4 | 0.0 | | Wafer Rotation [urad] | -0.118 | 0.000 | -12.0 | 0.0 | | Nonorthogonality [urad] | -0.010 | 0.000 | -1.0 | 0.0 | | Scaling in X [ppm] | -0.252 | 0.000 | -25.6 | 0.0 | | Scaling in Y [ppm] | -0.220 | 0.000 | -22.3 | 0.0 | | Rotation Scaling [urad/cm] | -0.005 | 0.000 | -0.8 | 0.0 | +------------------------------+----------+----------+----------+----------+ Residuals for this batch: +--------------------+---------+ | | Value | +====================+=========+ | Residual X [nm] | 31.0 | | Residual Y [nm] | 35.7 | +--------------------+---------+ Overlay Error after proposed Corrections are carried out: +------------------+-----------------------------+ | | Overlay Error | | +---------+---------+---------+ | | X | Y | Vector | | | [nm] | [nm] | [nm] | +==================+=========+=========+=========+ | Mean | -0.0 | 0.0 | | | St. Dev. | 31.4 | 36.4 | | | |Mean| + 3 Sigma | 94.3 | 109.3 | | | Maximum 99.7% | 61.8 | 74.9 | 91.6 | +------------------+---------+---------+---------+ THE FOLLOWING CORRECTIONS SHOULD BE APPLIED TO THE MACHINE CONSTANTS: +------------------------------------+-------------+-------------+-------------+ | | Reference | Correction | New | +====================================+=============+=============+=============+ | Matching Translation in X [um] | -0.014 | 0.016 | 0.002 | | Matching Translation in Y [um] | 0.002 | -0.006 | -0.005 | | Matching Rotation [urad] | -0.685 | -0.384 | -1.069 | | Matching Magnification [ppm] | -4.584 | 0.189 | -4.395 | | Matching 3rd Order Dist. [nm/cm3] | | | | | Matching Asym. Rotation [urad] | | | | | Matching Asym. Magnification [ppm] | | | | | Reticle Height [um] | | | | | Stone to Lens Tilt Rx [urad] | | | | | Stone to Lens Tilt Ry [urad] | | | | | White Level Sensor Tilt Rx [urad] | | | | | White Level Sensor Tilt Ry [urad] | | | | | Level Sensor Height [um] | | | | | Rotation Scaling [urad/cm] | 0.015 | -0.005 | 0.010 | | Wafer Rotation [urad] | | | | | Nonorthogonality [urad] | 0.022 | -0.010 | 0.012 | | Scaling in X [ppm] | | | | | Scaling in Y [ppm] | -0.254 | 0.032 | -0.222 | +------------------------------------+-------------+-------------+-------------+ update: ------ Save System Optimized State - ...ogy Calibration/Machine Matching/Field Matching Operator:ASM Machine:4419 Release:8.9.0 Date:12/16/2008 Time:00:26 Save System optimized State Matching Set ID Current : ORIGINAL Matching Set corrects for : Intrafield and Asymmetric Interfield offsets Lens matching Translation X [um] Current : -0.014 New : 0.002 Translation Y [um] Current : 0.002 New : -0.005 Rotation [urad] Current : -0.685 New : -1.069 Asym. Rotation [urad] Current : 0.000 New : 0.000 Magnification [ppm] Current : -4.584 New : -4.395 Asym. Magnification [ppm] Current : 0.000 New : 0.000 3rd Order Lens Distortion [nm/cm3] Current : 0.000 New : 0.000 Save System optimized State Grid Matching Non-Orthogonality [urad] Current : 0.022 New : 0.012 Scaling Factor Y [ppm] Current : -0.254 New : -0.222 Rotation Scaling [urad/cm] Current : 0.015 New : 0.010 test de verif: ------------- Data Modelling - Metrology Calibration/Machine Matching/Field Matching Operator:ASM Machine:4419 Release:8.9.0 Date:12/16/2008 Time:01:28 Machine to Machine Matching Exposure Layer : --- First --- : --- Second --- Date/Time : Wed Aug 9 23:05:57 2000 : Tue Dec 16 00:54:02 2008 Machine ID : 8317 : 4419 Reticle ID : 45440251DUV : MATCH5X0APAJ Reference Grid : : Matching set ID : DEFAULT : ORIGINAL Reticle Alignment : TTL Align : TTL Align Wafer Alignment : TTL Align : TTL Align Lens Type : 70 : 74 Lens ID : 0111654a : Energy [mJ/cm2] : 18.0 : 191.0 Focus Offset [um] : 0.00 : 0.00 Illumination Mode : Default : Conventional Blade ID : : Numerical Aperture : 0.66 : Sigma Inner : 0.00 : Sigma Outer : 0.65 : Temperature [degC] : 22.0 : 22.0 Pressure [mbar] : 992.5 : 990.6 Wavelength [nm] : 248.305 : 365.000 Comments from: 'Exposure First Layer' : 'Exposure Second Layer' : 'Measure Mark Positions' : 'XY-Imaging Modelling' : Test Log Name : XYM_4419_8317.tlg Optimization Method : Least-Squares Number of Wafers : 1 Number of Rejected Wafers : 0 Number of Fields per Wafer : 12 Number of Marks per Field : 17 Alignment Errors in Data : 0 Max Field Size X [mm] : 21.0 Y [mm] : 27.4 Wafer/Field/Mark Selection : *:*:* Align. Errors in Selection : 0 Overlay Mode : Second to First Set Threshold : OFF Reticle data used : Reticle data from testlog Reticle layout used : 4X_OV759_28R6_ASM80 ============================================================================== Overlay Error for this Batch: +------------------+-----------------------------+ | | Filtered Overlay Error | | +---------+---------+---------+ | | X | Y | Vector | | | [nm] | [nm] | [nm] | +==================+=========+=========+=========+ | Mean | -17.9 | 5.7 | | | St. Dev. | 33.3 | 38.6 | | | |Mean| + 3 Sigma | 117.7 | 121.5 | | | Maximum 99.7% | 88.5 | 82.1 | 92.8 | +------------------+---------+---------+---------+ Maximum Overlay Error positions for this Batch: +------+----------+---------+----------+-------------------------------+ | | | | |Corresponding Position in Field| | | | | +---------------+---------------+ | Nr | Max DX | Stdev | DY | X | Y | | | [nm] | [nm] | [nm] | [mm] | [mm] | +======+==========+=========+==========+===============+===============+ | 1 | 67.4 | 12.5 | 44.7 | -8.640 | 8.640 | | 2 | 56.7 | 20.8 | 10.4 | -8.640 | -8.640 | | 3 | 53.9 | 17.2 | 19.1 | 8.640 | -0.000 | | 4 | 49.9 | 16.4 | 40.7 | 4.320 | 4.320 | | 5 | 44.1 | 14.5 | 8.8 | 4.320 | -0.000 | | 6 | 31.4 | 15.1 | 11.4 | -0.000 | 8.640 | | 7 | 28.9 | 15.8 | 4.2 | -0.000 | -0.000 | | 8 | 27.9 | 13.6 | 24.3 | 4.320 | -4.320 | | 9 | 27.5 | 15.9 | 61.6 | -4.320 | -4.320 | | 10 | 26.7 | 14.0 | 17.2 | -4.320 | -0.000 | +------+----------+---------+----------+---------------+---------------+ +------+----------+---------+----------+-------------------------------+ | | | | |Corresponding Position in Field| | | | | +---------------+---------------+ | Nr | Max DY | Stdev | DX | X | Y | | | [nm] | [nm] | [nm] | [mm] | [mm] | +======+==========+=========+==========+===============+===============+ | 1 | 61.6 | 19.5 | 27.5 | -4.320 | -4.320 | | 2 | 53.0 | 18.5 | 23.6 | 8.640 | -8.640 | | 3 | 49.8 | 18.2 | 11.4 | -0.000 | -4.320 | | 4 | 44.7 | 15.2 | 67.4 | -8.640 | 8.640 | | 5 | 44.5 | 19.4 | 2.0 | 8.640 | 8.640 | | 6 | 43.9 | 13.7 | 4.2 | -0.000 | -8.640 | | 7 | 42.3 | 17.0 | 25.5 | -0.000 | 4.320 | | 8 | 40.7 | 20.7 | 49.9 | 4.320 | 4.320 | | 9 | 31.5 | 15.5 | 0.3 | -4.320 | 4.320 | | 10 | 24.4 | 17.3 | 21.2 | -8.640 | -0.000 | +------+----------+---------+----------+---------------+---------------+ Intrafield Overlay Error Classification: +------------------------------+---------------------+---------------------+ | | Model Parameters |Max. Resulting Errors| | +----------+----------+----------+----------+ | | Mean |Std. Dev. | Mean |Std. Dev. | | | | | [nm] | [nm] | +==============================+==========+==========+==========+==========+ | Translation in X [um] | -0.018 | 0.014 | -17.9 | 14.0 | | Translation in Y [um] | 0.006 | 0.016 | 5.7 | 16.0 | | Rotation [urad] | -0.210 | 0.344 | -3.1 | 5.1 | | Magnification [ppm] | -0.351 | 0.341 | -5.2 | 5.1 | | 3rd Order Dist. [nm/cm3] | | | | | | Asymm. Rotation [urad] | | | | | | Asymm. Magnification [ppm] | | | | | +------------------------------+----------+----------+----------+----------+ Interfield Overlay Error Classification: +------------------------------+---------------------+---------------------+ | | Model Parameters |Max. Resulting Errors| | +----------+----------+----------+----------+ | | Mean |Std. Dev. | Mean |Std. Dev. | | | | | [nm] | [nm] | +==============================+==========+==========+==========+==========+ | Translation in X [um] | -0.018 | 0.000 | -17.9 | 0.0 | | Translation in Y [um] | 0.006 | 0.000 | 5.7 | 0.0 | | Wafer Rotation [urad] | -0.096 | 0.000 | -9.7 | 0.0 | | Nonorthogonality [urad] | -0.004 | 0.000 | -0.4 | 0.0 | | Scaling in X [ppm] | -0.278 | 0.000 | -28.3 | 0.0 | | Scaling in Y [ppm] | -0.270 | 0.000 | -27.4 | 0.0 | | Rotation Scaling [urad/cm] | -0.011 | 0.000 | -1.6 | 0.0 | +------------------------------+----------+----------+----------+----------+ Residuals for this batch: +--------------------+---------+ | | Value | +====================+=========+ | Residual X [nm] | 31.5 | | Residual Y [nm] | 35.8 | +--------------------+---------+ Overlay Error after proposed Corrections are carried out: +------------------+-----------------------------+ | | Overlay Error | | +---------+---------+---------+ | | X | Y | Vector | | | [nm] | [nm] | [nm] | +==================+=========+=========+=========+ | Mean | -0.0 | -0.0 | | | St. Dev. | 31.9 | 36.3 | | | |Mean| + 3 Sigma | 95.6 | 109.0 | | | Maximum 99.7% | 62.4 | 73.9 | 90.0 | +------------------+---------+---------+---------+ THE FOLLOWING CORRECTIONS SHOULD BE APPLIED TO THE MACHINE CONSTANTS: +------------------------------------+-------------+-------------+-------------+ | | Reference | Correction | New | +====================================+=============+=============+=============+ | Matching Translation in X [um] | 0.002 | -0.018 | -0.016 | | Matching Translation in Y [um] | -0.005 | 0.006 | 0.001 | | Matching Rotation [urad] | -1.069 | -0.210 | -1.279 | | Matching Magnification [ppm] | -4.395 | -0.351 | -4.746 | | Matching 3rd Order Dist. [nm/cm3] | | | | | Matching Asym. Rotation [urad] | | | | | Matching Asym. Magnification [ppm] | | | | | Reticle Height [um] | | | | | Stone to Lens Tilt Rx [urad] | | | | | Stone to Lens Tilt Ry [urad] | | | | | White Level Sensor Tilt Rx [urad] | | | | | White Level Sensor Tilt Ry [urad] | | | | | Level Sensor Height [um] | | | | | Rotation Scaling [urad/cm] | 0.010 | -0.011 | -0.001 | | Wafer Rotation [urad] | | | | | Nonorthogonality [urad] | 0.012 | -0.004 | 0.009 | | Scaling in X [ppm] | | | | | Scaling in Y [ppm] | -0.222 | 0.009 | -0.213 | +------------------------------------+-------------+-------------+-------------+ update: ------- Save System Optimized State - ...ogy Calibration/Machine Matching/Field Matching Operator:ASM Machine:4419 Release:8.9.0 Date:12/16/2008 Time:01:31 Save System optimized State Matching Set ID Current : ORIGINAL Matching Set corrects for : Intrafield and Asymmetric Interfield offsets Lens matching Translation X [um] Current : 0.002 New : -0.016 Translation Y [um] Current : -0.005 New : 0.001 Rotation [urad] Current : -1.069 New : -1.279 Asym. Rotation [urad] Current : 0.000 New : 0.000 Magnification [ppm] Current : -4.395 New : -4.746 Asym. Magnification [ppm] Current : 0.000 New : 0.000 3rd Order Lens Distortion [nm/cm3] Current : 0.000 New : 0.000 Save System optimized State Grid Matching Non-Orthogonality [urad] Current : 0.012 New : 0.009 Scaling Factor Y [ppm] Current : -0.222 New : -0.213 Rotation Scaling [urad/cm] Current : 0.010 New : -0.001 test de verif: ------------- Data Modelling - Metrology Calibration/Machine Matching/Field Matching Operator:ASM Machine:4419 Release:8.9.0 Date:12/16/2008 Time:02:17 Machine to Machine Matching Exposure Layer : --- First --- : --- Second --- Date/Time : Wed Aug 9 23:05:57 2000 : Tue Dec 16 01:54:58 2008 Machine ID : 8317 : 4419 Reticle ID : 45440251DUV : MATCH5X0APAJ Reference Grid : : Matching set ID : DEFAULT : ORIGINAL Reticle Alignment : TTL Align : TTL Align Wafer Alignment : TTL Align : TTL Align Lens Type : 70 : 74 Lens ID : 0111654a : Energy [mJ/cm2] : 18.0 : 191.0 Focus Offset [um] : 0.00 : 0.00 Illumination Mode : Default : Conventional Blade ID : : Numerical Aperture : 0.66 : Sigma Inner : 0.00 : Sigma Outer : 0.65 : Temperature [degC] : 22.0 : 22.0 Pressure [mbar] : 992.5 : 990.4 Wavelength [nm] : 248.305 : 365.000 Comments from: 'Exposure First Layer' : 'Exposure Second Layer' : 'Measure Mark Positions' : 'XY-Imaging Modelling' : Test Log Name : XYM_4419_8317.tlg Optimization Method : Least-Squares Number of Wafers : 1 Number of Rejected Wafers : 0 Number of Fields per Wafer : 12 Number of Marks per Field : 17 Alignment Errors in Data : 0 Max Field Size X [mm] : 21.0 Y [mm] : 27.4 Wafer/Field/Mark Selection : *:*:* Align. Errors in Selection : 0 Overlay Mode : Second to First Set Threshold : OFF Reticle data used : Reticle data from testlog Reticle layout used : 4X_OV759_28R6_ASM80 ============================================================================== Overlay Error for this Batch: +------------------+-----------------------------+ | | Filtered Overlay Error | | +---------+---------+---------+ | | X | Y | Vector | | | [nm] | [nm] | [nm] | +==================+=========+=========+=========+ | Mean | 5.6 | 5.0 | | | St. Dev. | 34.6 | 39.4 | | | |Mean| + 3 Sigma | 109.5 | 123.2 | | | Maximum 99.7% | 70.9 | 83.8 | 102.6 | +------------------+---------+---------+---------+ Maximum Overlay Error positions for this Batch: +------+----------+---------+----------+-------------------------------+ | | | | |Corresponding Position in Field| | | | | +---------------+---------------+ | Nr | Max DX | Stdev | DY | X | Y | | | [nm] | [nm] | [nm] | [mm] | [mm] | +======+==========+=========+==========+===============+===============+ | 1 | 53.9 | 12.3 | 53.5 | 8.640 | -8.640 | | 2 | 50.2 | 16.7 | 58.9 | -4.320 | -4.320 | | 3 | 49.9 | 16.1 | 15.3 | -4.320 | -0.000 | | 4 | 48.9 | 12.7 | 43.8 | -8.640 | 8.640 | | 5 | 45.0 | 13.8 | 22.8 | -8.640 | -0.000 | | 6 | 39.2 | 31.6 | 22.0 | -8.640 | -8.640 | | 7 | 28.4 | 17.3 | 18.2 | 8.640 | -0.000 | | 8 | 26.1 | 16.3 | 40.1 | 4.320 | 4.320 | | 9 | 23.2 | 20.0 | 49.5 | 8.640 | 8.640 | | 10 | 22.2 | 14.3 | 41.4 | -0.000 | -8.640 | +------+----------+---------+----------+---------------+---------------+ +------+----------+---------+----------+-------------------------------+ | | | | |Corresponding Position in Field| | | | | +---------------+---------------+ | Nr | Max DY | Stdev | DX | X | Y | | | [nm] | [nm] | [nm] | [mm] | [mm] | +======+==========+=========+==========+===============+===============+ | 1 | 58.9 | 21.5 | 50.2 | -4.320 | -4.320 | | 2 | 53.5 | 21.2 | 53.9 | 8.640 | -8.640 | | 3 | 49.7 | 18.8 | 11.7 | -0.000 | -4.320 | | 4 | 49.5 | 19.6 | 23.2 | 8.640 | 8.640 | | 5 | 43.8 | 17.0 | 48.9 | -8.640 | 8.640 | | 6 | 42.2 | 19.0 | 3.6 | -0.000 | 4.320 | | 7 | 41.4 | 17.5 | 22.2 | -0.000 | -8.640 | | 8 | 40.1 | 22.5 | 26.1 | 4.320 | 4.320 | | 9 | 31.8 | 16.6 | 22.1 | -4.320 | 4.320 | | 10 | 24.3 | 23.1 | 3.0 | 4.320 | -4.320 | +------+----------+---------+----------+---------------+---------------+ Intrafield Overlay Error Classification: +------------------------------+---------------------+---------------------+ | | Model Parameters |Max. Resulting Errors| | +----------+----------+----------+----------+ | | Mean |Std. Dev. | Mean |Std. Dev. | | | | | [nm] | [nm] | +==============================+==========+==========+==========+==========+ | Translation in X [um] | 0.006 | 0.014 | 5.6 | 14.1 | | Translation in Y [um] | 0.005 | 0.018 | 5.0 | 17.6 | | Rotation [urad] | 0.049 | 0.376 | 0.7 | 5.6 | | Magnification [ppm] | 0.009 | 0.530 | 0.1 | 7.9 | | 3rd Order Dist. [nm/cm3] | | | | | | Asymm. Rotation [urad] | | | | | | Asymm. Magnification [ppm] | | | | | +------------------------------+----------+----------+----------+----------+ Interfield Overlay Error Classification: +------------------------------+---------------------+---------------------+ | | Model Parameters |Max. Resulting Errors| | +----------+----------+----------+----------+ | | Mean |Std. Dev. | Mean |Std. Dev. | | | | | [nm] | [nm] | +==============================+==========+==========+==========+==========+ | Translation in X [um] | 0.006 | 0.000 | 5.6 | 0.0 | | Translation in Y [um] | 0.005 | 0.000 | 5.0 | 0.0 | | Wafer Rotation [urad] | -0.095 | 0.000 | -9.7 | 0.0 | | Nonorthogonality [urad] | 0.002 | 0.000 | 0.2 | 0.0 | | Scaling in X [ppm] | -0.255 | 0.000 | -25.9 | 0.0 | | Scaling in Y [ppm] | -0.301 | 0.000 | -30.6 | 0.0 | | Rotation Scaling [urad/cm] | 0.003 | 0.000 | 0.4 | 0.0 | +------------------------------+----------+----------+----------+----------+ Residuals for this batch: +--------------------+---------+ | | Value | +====================+=========+ | Residual X [nm] | 32.5 | | Residual Y [nm] | 36.5 | +--------------------+---------+ Overlay Error after proposed Corrections are carried out: +------------------+-----------------------------+ | | Overlay Error | | +---------+---------+---------+ | | X | Y | Vector | | | [nm] | [nm] | [nm] | +==================+=========+=========+=========+ | Mean | -0.0 | -0.0 | | | St. Dev. | 33.7 | 37.4 | | | |Mean| + 3 Sigma | 101.0 | 112.1 | | | Maximum 99.7% | 67.5 | 83.9 | 90.0 | +------------------+---------+---------+---------+ THE FOLLOWING CORRECTIONS SHOULD BE APPLIED TO THE MACHINE CONSTANTS: +------------------------------------+-------------+-------------+-------------+ | | Reference | Correction | New | +====================================+=============+=============+=============+ | Matching Translation in X [um] | -0.016 | 0.006 | -0.010 | | Matching Translation in Y [um] | 0.001 | 0.005 | 0.006 | | Matching Rotation [urad] | -1.279 | 0.049 | -1.229 | | Matching Magnification [ppm] | -4.746 | 0.009 | -4.737 | | Matching 3rd Order Dist. [nm/cm3] | | | | | Matching Asym. Rotation [urad] | | | | | Matching Asym. Magnification [ppm] | | | | | Reticle Height [um] | | | | | Stone to Lens Tilt Rx [urad] | | | | | Stone to Lens Tilt Ry [urad] | | | | | White Level Sensor Tilt Rx [urad] | | | | | White Level Sensor Tilt Ry [urad] | | | | | Level Sensor Height [um] | | | | | Rotation Scaling [urad/cm] | -0.001 | 0.003 | 0.002 | | Wafer Rotation [urad] | | | | | Nonorthogonality [urad] | 0.009 | 0.002 | 0.011 | | Scaling in X [ppm] | | | | | Scaling in Y [ppm] | -0.213 | -0.047 | -0.260 | +------------------------------------+-------------+-------------+-------------+ -------------------------------------------------------------------------------- CD Matching -------------------------------------------------------------------------------- fait pAr tpm svg -------------------------------------------------------------------------------- Back-up Machine Constants sur hd -------------------------------------------------------------------------------- 12/16/2008 02:19:44 Machine:4419 (Rel:8.9.0.c, MCST [23428], MCMA_step.c, 1516) OK All Machine Constants are backed up to file: MC/4419_ALL_machine.const.2008_12_16.02h19m44.tgz Crated ~1995 vintage.

ASML AT 1150iS Twinscan Immersion lithography tool, currently installed in a cleanroom.

ASML 5500 / 300 DUV stepper, crated in a warehouse.

ASML Twinscan XT 400F I-Line scanner, 12".

ASML PAS 5500 / 300 Stepper, 248nm Crated in a warehouse.

ASML PAS 5500 / 250C Stepper.

ASML PAS 5500 / 850C Scanners, 8" Specifications: 248nm Slit Uniformity: Uniformity - 1.48 X-tilt - 0.43 Assysmetric - 1.32 Intensity - 2514 Straylight - 1.36 FDP - 58 Astigmatism - 30.

ASML 5500 / 100C Stepper.